Kenji Fukumoto

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Hirakata, JP

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for forming bump
- Patent number 7,350,684
- Issue date Apr 1, 2008
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for forming bump
- Patent number 6,910,613
- Issue date Jun 28, 2005
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical load-lock reduced-pressure type chemical vapor deposition...
- Patent number 5,058,526
- Issue date Oct 22, 1991
- Matsushita Electric Industrial Co., Ltd.
- Yoshinari Matsushita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of applying a coating of viscous materials
- Patent number 5,000,988
- Issue date Mar 19, 1991
- Matsushita Electric Industrial Co., Ltd.
- Takao Inoue
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Chemical vapor deposition reaction apparatus having isolated reacti...
- Patent number 4,962,726
- Issue date Oct 16, 1990
- Matsushita Electric Industrial Co., Ltd.
- Yoshinari Matsushita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Apparatus and method for forming bump
- Publication number 20050191838
- Publication date Sep 1, 2005
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and method for forming bump
- Publication number 20040102030
- Publication date May 27, 2004
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS