Kenji Fukuzono

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Optical module
- Patent number 10,586,770
- Issue date Mar 10, 2020
- Fujitsu Limited
- Takayoshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module
- Patent number 10,444,450
- Issue date Oct 15, 2019
- Fujitsu Limited
- Takayoshi Matsumura
- G02 - OPTICS
Information Patent Grant
BGA package substrate and method of manufacturing the same
- Patent number 10,418,310
- Issue date Sep 17, 2019
- Fujitsu Limited
- Yuki Hoshino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical module and method of manufacturing optical module
- Patent number 10,261,249
- Issue date Apr 16, 2019
- Fujitsu Limited
- Norio Kainuma
- G02 - OPTICS
Information Patent Grant
Package substrate and method of manufacturing package substrate
- Patent number 10,181,437
- Issue date Jan 15, 2019
- Fujitsu Limited
- Manabu Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package mounting structure
- Patent number 9,515,005
- Issue date Dec 6, 2016
- Fujitsu Limited
- Shunji Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for manufacturing same
- Patent number 9,362,202
- Issue date Jun 7, 2016
- Fujitsu Limited
- Shunji Baba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor apparatus and manufacturing method thereof
- Patent number 9,006,876
- Issue date Apr 14, 2015
- Fujitsu Limited
- Manabu Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, wiring board unit, and electronic apparatus
- Patent number 8,933,558
- Issue date Jan 13, 2015
- Fujitsu Limited
- Manabu Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device mounting structure
- Patent number 8,866,270
- Issue date Oct 21, 2014
- Fujitsu Limited
- Manabu Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device mounting structure, method of manufacturing th...
- Patent number 8,716,839
- Issue date May 6, 2014
- Fujitsu Limited
- Manabu Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board, printed circuit board fabrication method, an...
- Patent number 8,642,896
- Issue date Feb 4, 2014
- Fujitsu Limited
- Kenji Fukuzono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method of a semiconductor de...
- Patent number 8,168,471
- Issue date May 1, 2012
- Fujitsu Limited
- Takashi Kanda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making printed wiring board and method of making printed...
- Patent number 8,152,953
- Issue date Apr 10, 2012
- Fujitsu Limited
- Hideaki Yoshimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 8,119,923
- Issue date Feb 21, 2012
- Fujitsu Limited
- Hideaki Yoshimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and heat radiation member
- Patent number 8,089,146
- Issue date Jan 3, 2012
- Fujitsu Limited
- Kenji Fukuzono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board unit and semiconductor package
- Patent number 8,023,268
- Issue date Sep 20, 2011
- Fujitsu Limited
- Kenji Fukuzono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a manufacturing method thereof
- Patent number 8,004,096
- Issue date Aug 23, 2011
- Fujitsu Limited
- Kenji Fukuzono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing multilayer board
- Patent number 7,943,001
- Issue date May 17, 2011
- Fujitsu Limited
- Takashi Nakagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board unit
- Patent number 7,787,257
- Issue date Aug 31, 2010
- Fujitsu Limited
- Kenji Fukuzono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging method, packaging structure and package substrate for ele...
- Patent number 7,291,901
- Issue date Nov 6, 2007
- Fujitsu Limited
- Masateru Koide
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging method, packaging structure and package substrate for ele...
- Patent number 7,268,002
- Issue date Sep 11, 2007
- Fujitsu Limited
- Masateru Koide
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board design aiding apparatus, printed wiring board...
- Patent number 7,260,806
- Issue date Aug 21, 2007
- Fujitsu Limited
- Kenji Fukuzono
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Board design aiding apparatus, board design aiding method and board...
- Patent number 7,222,316
- Issue date May 22, 2007
- Fujitsu Limited
- Kenji Fukuzono
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device having stiffener
- Patent number 7,053,493
- Issue date May 30, 2006
- Fujitsu Limited
- Takashi Kanda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a semiconductor device with adhesive sealing subje...
- Patent number 6,869,822
- Issue date Mar 22, 2005
- Fujitsu Limited
- Tomohisa Yagi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20210375771
- Publication date Dec 2, 2021
- Fujitsu Limited
- KENJI FUKUZONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE
- Publication number 20190157207
- Publication date May 23, 2019
- Fujitsu Limited
- Takayoshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BGA PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180366398
- Publication date Dec 20, 2018
- Fujitsu Limited
- Yuki Hoshino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING PACKAGE SUBSTRATE
- Publication number 20180358289
- Publication date Dec 13, 2018
- Fujitsu Limited
- MANABU WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE
- Publication number 20180341075
- Publication date Nov 29, 2018
- Fujitsu Limited
- Takayoshi Matsumura
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
OPTICAL MODULE
- Publication number 20180217343
- Publication date Aug 2, 2018
- Fujitsu Limited
- Takayoshi Matsumura
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE AND METHOD OF MANUFACTURING OPTICAL MODULE
- Publication number 20180156972
- Publication date Jun 7, 2018
- Fujitsu Limited
- NORIO KAINUMA
- G02 - OPTICS
Information Patent Application
LIQUID-COOLED JACKET AND ELECTRONIC DEVICE
- Publication number 20150359141
- Publication date Dec 10, 2015
- Fujitsu Limited
- KENJI FUKUZONO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20150264810
- Publication date Sep 17, 2015
- Fujitsu Limited
- Shunji BABA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20150003012
- Publication date Jan 1, 2015
- Fujitsu Limited
- Shunji BABA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE MOUNTING STRUCTURE
- Publication number 20140376187
- Publication date Dec 25, 2014
- Fujitsu Limited
- Shunji Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20140319667
- Publication date Oct 30, 2014
- Fujitsu Limited
- Manabu WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING COOLING DEVICE, COOLING DEVICE AND ELECTRO...
- Publication number 20140209285
- Publication date Jul 31, 2014
- Fujitsu Limited
- Yuki HOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE MOUNTING STRUCTURE
- Publication number 20140193953
- Publication date Jul 10, 2014
- Fujitsu Limited
- Manabu WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING HEAD AND ELECTRONIC APPARATUS
- Publication number 20140190669
- Publication date Jul 10, 2014
- Fujitsu Limited
- Yuki HOSHINO
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE MOUNTING STRUCTURE, METHOD OF MANUFACTURING TH...
- Publication number 20130341767
- Publication date Dec 26, 2013
- Fujitsu Limited
- Manabu WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND WIRING BOARD UNIT
- Publication number 20130314877
- Publication date Nov 28, 2013
- Fujitsu Limited
- Manabu WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20130083504
- Publication date Apr 4, 2013
- Fujitsu Limited
- Kenji FUKUZONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, WIRING BOARD UNIT, AND ELECTRONIC APPARATUS
- Publication number 20130083488
- Publication date Apr 4, 2013
- Fujitsu Limited
- Manabu WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP MODULE, PRINTED WIRING BOARD, METHOD FOR MANUFACTURING MU...
- Publication number 20130021769
- Publication date Jan 24, 2013
- Fujitsu Limited
- Kenji FUKUZONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE BODY AND PRINTED WIRING BOARD AND METHOD OF...
- Publication number 20110100690
- Publication date May 5, 2011
- Fujitsu Limited
- Hideaki Yoshimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD FABRICATION METHOD, AN...
- Publication number 20100326714
- Publication date Dec 30, 2010
- FUJITSU LIMITED
- Kenji FUKUZONO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF A SEMICONDUCTOR DE...
- Publication number 20100151632
- Publication date Jun 17, 2010
- Fujitsu Limited
- Takashi KANDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND HEAT RADIATION MEMBER
- Publication number 20100127364
- Publication date May 27, 2010
- Fujitsu Limited
- Kenji Fukuzono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed circuit board unit and semiconductor package
- Publication number 20100014254
- Publication date Jan 21, 2010
- FUJITSU LIMITED
- Kenji Fukuzono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING PRINTED WIRING BOARD AND METHOD OF MAKING PRINTED...
- Publication number 20090294056
- Publication date Dec 3, 2009
- Fujitsu Limited
- Hideaki YOSHIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING PRINTED WIRING BOARD AND ELECTRICALLY-CONDUCTIVE B...
- Publication number 20090294160
- Publication date Dec 3, 2009
- Fujitsu Limited
- Hideaki YOSHIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD UNIT
- Publication number 20090196002
- Publication date Aug 6, 2009
- FUJITSU LIMITED
- Kenji Fukuzono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20090084590
- Publication date Apr 2, 2009
- FUJITSU LIMITED
- Hideaki YOSHIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package, method of production of same, printed circui...
- Publication number 20080006915
- Publication date Jan 10, 2008
- FUJITSU LIMITED
- Naoaki Nakamura
- H01 - BASIC ELECTRIC ELEMENTS

Kenji Fukuzono

Person

Patents Grantslast 30 patents

Optical module

Optical module

BGA package substrate and method of manufacturing the same

Optical module and method of manufacturing optical module

Package substrate and method of manufacturing package substrate

Package mounting structure

Electronic device and method for manufacturing same

Semiconductor apparatus and manufacturing method thereof

Semiconductor package, wiring board unit, and electronic apparatus

Method of manufacturing semiconductor device mounting structure

Semiconductor device mounting structure, method of manufacturing th...

Printed circuit board, printed circuit board fabrication method, an...

Semiconductor device and manufacturing method of a semiconductor de...

Method of making printed wiring board and method of making printed...

Circuit board

Semiconductor device and heat radiation member

Printed circuit board unit and semiconductor package

Semiconductor device and a manufacturing method thereof

Process for producing multilayer board

Printed wiring board unit

Packaging method, packaging structure and package substrate for ele...

Packaging method, packaging structure and package substrate for ele...

Printed wiring board design aiding apparatus, printed wiring board...

Board design aiding apparatus, board design aiding method and board...

Semiconductor device having stiffener

Method of making a semiconductor device with adhesive sealing subje...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

OPTICAL MODULE

BGA PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING PACKAGE SUBSTRATE

OPTICAL MODULE

OPTICAL MODULE

OPTICAL MODULE AND METHOD OF MANUFACTURING OPTICAL MODULE

LIQUID-COOLED JACKET AND ELECTRONIC DEVICE

CIRCUIT BOARD AND MANUFACTURING METHOD OF CIRCUIT BOARD

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME

PACKAGE MOUNTING STRUCTURE

SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING COOLING DEVICE, COOLING DEVICE AND ELECTRO...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE MOUNTING STRUCTURE

COOLING HEAD AND ELECTRONIC APPARATUS

SEMICONDUCTOR DEVICE MOUNTING STRUCTURE, METHOD OF MANUFACTURING TH...

SEMICONDUCTOR PACKAGE AND WIRING BOARD UNIT

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE, WIRING BOARD UNIT, AND ELECTRONIC APPARATUS

MULTICHIP MODULE, PRINTED WIRING BOARD, METHOD FOR MANUFACTURING MU...

ELECTRICALLY CONDUCTIVE BODY AND PRINTED WIRING BOARD AND METHOD OF...

PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD FABRICATION METHOD, AN...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF A SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE AND HEAT RADIATION MEMBER

Printed circuit board unit and semiconductor package

METHOD OF MAKING PRINTED WIRING BOARD AND METHOD OF MAKING PRINTED...

METHOD OF MAKING PRINTED WIRING BOARD AND ELECTRICALLY-CONDUCTIVE B...

PRINTED WIRING BOARD UNIT

CIRCUIT BOARD

Semiconductor package, method of production of same, printed circui...