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Kenji Hiwa

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  • Nirasaki-shi, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Method for forming Cu film and storage medium
    • Patent number 8,697,572
    • Issue date Apr 15, 2014
    • Tokyo Electron Limited
    • Yasuhiko Kojima
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD FOR FORMING CU FILM, AND STORAGE MEDIUM
    • Publication number 20120064247
    • Publication date Mar 15, 2012
    • TOKYO ELECTRON LIMITED
    • Kenji Hiwa
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    METHOD FOR FORMING CU FILM AND STORAGE MEDIUM
    • Publication number 20120064248
    • Publication date Mar 15, 2012
    • TOKYO ELECTRON LIMITED
    • Yasuhiko Kojima
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    METHOD FOR FORMING Cu FILM AND STORAGE MEDIUM
    • Publication number 20120040085
    • Publication date Feb 16, 2012
    • TOKYO ELECTRON LIMITED
    • Yasuhiko KOJIMA
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    METHOD FOR FORMING CU FILM AND STORAGE MEDIUM
    • Publication number 20120028462
    • Publication date Feb 2, 2012
    • TOKYO ELECTRON LIMITED
    • Yasuhiko KOJIMA
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...