Kenji Iketaki

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Kawasaki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Reflowing apparatus and reflowing method
- Patent number 7,759,613
- Issue date Jul 20, 2010
- Fujitsu Limited
- Kenji Iketaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board device having heat-absorbing dummy parts, and...
- Patent number 6,787,711
- Issue date Sep 7, 2004
- Fujitsu Limited
- Shunichi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of bonding piezoelectric element and electrode, and piezoele...
- Patent number 6,744,183
- Issue date Jun 1, 2004
- Fujitsu Limited
- Masayuki Kitajima
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of bonding piezoelectric element and electrode, and piezoele...
- Patent number 6,541,898
- Issue date Apr 1, 2003
- Fujitsu Limited
- Masayuki Kitajima
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of assembling micro-actuator
- Patent number 6,467,141
- Issue date Oct 22, 2002
- Fujitsu Limited
- Toru Okada
- G11 - INFORMATION STORAGE
Information Patent Grant
Soldering apparatus
- Patent number 5,560,534
- Issue date Oct 1, 1996
- Fujitsu Limited
- Toru Okada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Reflowing apparatus and reflowing method
- Publication number 20070267465
- Publication date Nov 22, 2007
- FUJITSU LIMITED
- Kenji Iketaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board
- Publication number 20060007661
- Publication date Jan 12, 2006
- FUJITSU LIMITED
- Kenji Iketaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of bonding piezoelectric element and electrode, and piezoele...
- Publication number 20030137223
- Publication date Jul 24, 2003
- Fujitsu Limited
- Masayuki Kitajima
- G11 - INFORMATION STORAGE
Information Patent Application
Printed wiring board device having heat-absorbing dummy parts, and...
- Publication number 20030111262
- Publication date Jun 19, 2003
- Shunichi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of bonding piezoelectric element and electrode, and piezoele...
- Publication number 20020074902
- Publication date Jun 20, 2002
- FUJITSU LIMITED
- Masayuki Kitajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of assembling micro-actuator
- Publication number 20020059717
- Publication date May 23, 2002
- FUJITSU LIMITED
- Toru Okada
- H01 - BASIC ELECTRIC ELEMENTS