Kenji Itoh

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonding method and apparatus
- Patent number 6,676,005
- Issue date Jan 13, 2004
- International Business Machines Corporation
- Kenji Itoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Appearance inspecting jig for small parts and inspecting method emp...
- Patent number 6,628,380
- Issue date Sep 30, 2003
- International Business Machines Corporation
- Masashi Fujimori
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of wiring a head suspension assembly
- Patent number 6,553,647
- Issue date Apr 29, 2003
- International Business Machines Corporation
- Kenji Itoh
- G11 - INFORMATION STORAGE
Information Patent Grant
Apparatus and method for configuring and electrically interconnecti...
- Patent number 6,493,189
- Issue date Dec 10, 2002
- International Business Machines Corporation
- Kenji Itoh
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for ultrasonically connecting and inspecting slider-lead joi...
- Patent number 6,355,122
- Issue date Mar 12, 2002
- International Business Machines Corporation
- Kenji Itoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Wire bonding method and apparatus
- Publication number 20030010806
- Publication date Jan 16, 2003
- Kenji Itoh
- H01 - BASIC ELECTRIC ELEMENTS