Kenji IWATA

Person

  • Chigasaki-shi, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Substrate processing device

    • Patent number 10,490,390
    • Issue date Nov 26, 2019
    • ULVAC, Inc.
    • Tetsushi Fujinaga
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

  • Information Patent Application

    SUBSTRATE PROCESSING DEVICE

    • Publication number 20180012734
    • Publication date Jan 11, 2018
    • Ulvac, Inc.
    • Tetsushi FUJINAGA
    • H01 - BASIC ELECTRIC ELEMENTS