Kenji Kigima

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Package for semiconductor power device and method for assembling th...
- Patent number 6,597,063
- Issue date Jul 22, 2003
- Kabushiki Kaisha Toshiba
- Toshio Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for semiconductor power device and method for assembling th...
- Patent number 6,201,696
- Issue date Mar 13, 2001
- Kabushiki Kaisha Toshiba
- Toshio Shimizu
- H01 - BASIC ELECTRIC ELEMENTS