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Kenji Kita

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wafer-adhering adhesive tape
    • Patent number 8,722,184
    • Issue date May 13, 2014
    • The Furukawa Electric Co., Ltd.
    • Yasumasa Morishima
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Grant

    Wafer-processing tape and method of producing the same
    • Patent number 8,545,979
    • Issue date Oct 1, 2013
    • The Furukawa Electric Co., Ltd.
    • Kenji Kita
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Grant

    Method of producing a semiconductor device, and wafer-processing tape
    • Patent number 8,043,698
    • Issue date Oct 25, 2011
    • The Furukawa Electric Co., Ltd.
    • Yasumasa Morishima
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Grant

    Dicing/die bonding sheet
    • Patent number 7,517,724
    • Issue date Apr 14, 2009
    • Hitachi Chemical Company, Ltd.
    • Keiichi Hatakeyama
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

  • Information Patent Application

    WAFER-ADHERING ADHESIVE TAPE
    • Publication number 20080299345
    • Publication date Dec 4, 2008
    • Yasumasa MORISHIMA
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    Method of producing a semiconductor device, and wafer-processing tape
    • Publication number 20070141330
    • Publication date Jun 21, 2007
    • THE FURUKAWA ELECTRIC CO., LTD.
    • Yasumasa Morishima
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    Dicing/die bonding sheet
    • Publication number 20070026572
    • Publication date Feb 1, 2007
    • Keiichi Hatakeyama
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Application

    Wafer-processing tape
    • Publication number 20060204749
    • Publication date Sep 14, 2006
    • THE FURUKAWA ELECTRIC CO., LTD.
    • Kenji Kita
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    Wafer-processing tape and method of producing the same
    • Publication number 20060154066
    • Publication date Jul 13, 2006
    • THE FURUKAWA ELECTRIC CO., LTD.
    • Kenji Kita
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    Wafer-adhering adhesive tape
    • Publication number 20050249909
    • Publication date Nov 10, 2005
    • THE FURUKAWA ELECTRIC CO., LTD.
    • Yasumasa Morishima
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...