Kenji Kitazawa

Person

Yamashita-cho, Kokubu, Kagoshima-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Surface-acoustic-wave-device mount substrate, high-frequency module...
- Patent number 7,352,105
- Issue date Apr 1, 2008
- Kyocera Corporation
- Hiroyuki Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency module and communication apparatus
- Patent number 7,289,008
- Issue date Oct 30, 2007
- Kyocera Corporation
- Hiroshi Kuroki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
High frequency module
- Patent number 6,961,245
- Issue date Nov 1, 2005
- Kyocera Corporation
- Takanori Ikuta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric waveguide type filter and branching filter
- Patent number 6,927,653
- Issue date Aug 9, 2005
- Kyocera Corporation
- Hiroshi Uchimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency module
- Patent number 6,873,529
- Issue date Mar 29, 2005
- Kyocera Corporation
- Takanori Ikuta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layered wiring board for slot coupling a transmission line to...
- Patent number 6,870,438
- Issue date Mar 22, 2005
- Kyocera Corporation
- Naoyuki Shino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High frequency package, wiring board, and high frequency module hav...
- Patent number 6,642,808
- Issue date Nov 4, 2003
- Kyocera Corporation
- Shinichi Koriyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High frequency wiring board and its connecting structure
- Patent number 6,501,352
- Issue date Dec 31, 2002
- Kyocera Corporation
- Shinichi Koriyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency module using slot coupling
- Patent number 6,483,406
- Issue date Nov 19, 2002
- Kyocera Corporation
- Yoshinobu Sawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency module coupled via aperture in a ground plane
- Patent number 6,356,173
- Issue date Mar 12, 2002
- Kyocera Corporation
- Koichi Nagata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency package
- Patent number 6,239,669
- Issue date May 29, 2001
- Kyocera Corporation
- Shinichi Koriyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slot antenna
- Patent number 6,188,368
- Issue date Feb 13, 2001
- Shinichi Koriyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for mounting a high-frequency package
- Patent number 6,057,600
- Issue date May 2, 2000
- Kyocera Corporation
- Kenji Kitazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency semiconductor device and mounted structure thereof
- Patent number 5,952,709
- Issue date Sep 14, 1999
- Kyocera Corporation
- Kenji Kitazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer support member
- Patent number 5,886,863
- Issue date Mar 23, 1999
- Kyocera Corporation
- Koichi Nagasaki
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Ceramic resistor and electrostatic chuck having an aluminum nitride...
- Patent number 5,777,543
- Issue date Jul 7, 1998
- Kyocera Corporation
- Hiroshi Aida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic resistor and electrostatic chuck having an aluminum nitride...
- Patent number 5,668,524
- Issue date Sep 16, 1997
- Kyocera Corporation
- Hiroshi Aida
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Surface-acoustic-wave-device mount substrate, high-frequency module...
- Publication number 20060186755
- Publication date Aug 24, 2006
- KYOCERA CORPORATION
- Hiroyuki Mori
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
HIGH FREQUENCY MODULE
- Publication number 20050146854
- Publication date Jul 7, 2005
- KYOCERA CORPORATION
- Takanori Ikuta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High-frequency module and communication apparatus
- Publication number 20050104685
- Publication date May 19, 2005
- KYOCERA CORPORATION
- Hiroshi Kuroki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Dielectric waveguide type filter and branching filter
- Publication number 20040041663
- Publication date Mar 4, 2004
- Hiroshi Uchimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High frequency module
- Publication number 20030169575
- Publication date Sep 11, 2003
- KYOCERA CORPORATION
- Takanori Ikuta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High frequency package, wiring board, and high frequency module
- Publication number 20020003298
- Publication date Jan 10, 2002
- Shinichi Koriyama
- H01 - BASIC ELECTRIC ELEMENTS

Kenji Kitazawa

Person

Patents Grantslast 30 patents

Surface-acoustic-wave-device mount substrate, high-frequency module...

High-frequency module and communication apparatus

High frequency module

Dielectric waveguide type filter and branching filter

High frequency module

Multi-layered wiring board for slot coupling a transmission line to...

High frequency package, wiring board, and high frequency module hav...

High frequency wiring board and its connecting structure

High-frequency module using slot coupling

High-frequency module coupled via aperture in a ground plane

High frequency package

Slot antenna

Structure for mounting a high-frequency package

High-frequency semiconductor device and mounted structure thereof

Wafer support member

Ceramic resistor and electrostatic chuck having an aluminum nitride...

Ceramic resistor and electrostatic chuck having an aluminum nitride...

Patents Applicationslast 30 patents

Surface-acoustic-wave-device mount substrate, high-frequency module...

HIGH FREQUENCY MODULE

High-frequency module and communication apparatus

Dielectric waveguide type filter and branching filter

High frequency module

High frequency package, wiring board, and high frequency module