Kenji Kubota

Person

Aizuwakamatsu-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bonded body and insulating circuit board
- Patent number 12,137,526
- Issue date Nov 5, 2024
- Mitsubishi Materials Corporation
- Marina Sakamaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Terminal material for connectors
- Patent number 11,901,659
- Issue date Feb 13, 2024
- Mitsubishi Materials Corporation
- Yoshie Tarutani
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper alloy plate, plating film-attached copper alloy plate, and m...
- Patent number 11,781,234
- Issue date Oct 10, 2023
- Mitsubishi Materials Corporation
- Naoki Miyashima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Terminal material for connector
- Patent number 11,761,109
- Issue date Sep 19, 2023
- Mitsubishi Materials Corporation
- Yoshie Tarutani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for producing high-purity electrolytic copper
- Patent number 11,753,733
- Issue date Sep 12, 2023
- Mitsubishi Materials Corporation
- Yoshie Tarutani
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Terminal material for connectors
- Patent number 11,721,923
- Issue date Aug 8, 2023
- Mitsubishi Materials Corporation
- Yoshie Tarutani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Anti-corrosion terminal material, anti-corrosion terminal and elect...
- Patent number 11,661,667
- Issue date May 30, 2023
- Mitsubishi Materials Corporation
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Terminal material with silver coating film and terminal with silver...
- Patent number 11,530,490
- Issue date Dec 20, 2022
- Mitsubishi Materials Corporation
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
High-purity electrolytic copper
- Patent number 11,453,953
- Issue date Sep 27, 2022
- Mitsubishi Materials Corporation
- Yoshie Tarutani
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Tin-plated copper terminal material, terminal, and electric-wire te...
- Patent number 11,264,750
- Issue date Mar 1, 2022
- Mitsubishi Materials Corporation
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Terminal material for connectors, terminal, and electric wire termi...
- Patent number 11,211,729
- Issue date Dec 28, 2021
- Mitsubishi Materials Corporation
- Kenji Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tin-plated copper terminal material, terminal, and wire terminal pa...
- Patent number 11,088,472
- Issue date Aug 10, 2021
- Mitsubishi Materials Corporation
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Corrosion-resistant terminal material, corrosion-resistant terminal...
- Patent number 10,910,130
- Issue date Feb 2, 2021
- Mitsubishi Materials Corporation
- Kenji Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tin-plated copper terminal material, terminal and electric wire ter...
- Patent number 10,858,750
- Issue date Dec 8, 2020
- Mitsubishi Materials Corporation
- Kenji Kubota
- B32 - LAYERED PRODUCTS
Information Patent Grant
Tinned copper terminal material, terminal, and electrical wire end...
- Patent number 10,801,115
- Issue date Oct 13, 2020
- Mitsubishi Materials Corporation
- Kenji Kubota
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Additive for high-purity copper electrolytic refining and method of...
- Patent number 10,793,956
- Issue date Oct 6, 2020
- Mitsubishi Materials Corporation
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Additive for high-purity copper electrolytic refining, method of pr...
- Patent number 10,428,434
- Issue date Oct 1, 2019
- Mitsubishi Materials Corporation
- Yoshie Tarutani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Additive for high-purity copper electrolytic refining and method of...
- Patent number 10,407,785
- Issue date Sep 10, 2019
- Mitsubishi Materials Corporation
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Additive for high-purity copper electrolytic refining and method of...
- Patent number 10,358,730
- Issue date Jul 23, 2019
- Mitsubishi Materials Corporation
- Yoshie Tarutani
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of manufacturing tin-plated copper terminal material
- Patent number 10,301,737
- Issue date May 28, 2019
- Mitsubishi Materials Corporation
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Tin-plated copper-alloy material for terminal having excellent inse...
- Patent number 9,616,639
- Issue date Apr 11, 2017
- MISTUBISHI MATERIALS CORPORATION
- Yuki Taninouchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Conductive member and method for producing the same
- Patent number 8,981,233
- Issue date Mar 17, 2015
- Mitsubishi Shindoh Co., Ltd.
- Takeshi Sakurai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Tin-plated copper-alloy material for terminal and method for produc...
- Patent number 8,940,404
- Issue date Jan 27, 2015
- Mitsubishi Materials Corporation
- Yuki Taninouchi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Conductive member and method for producing the same
- Patent number 8,698,002
- Issue date Apr 15, 2014
- Mitsubishi Shindoh Co., Ltd.
- Takeshi Sakurai
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
BONDED BODY AND INSULATING CIRCUIT BOARD
- Publication number 20250024610
- Publication date Jan 16, 2025
- MITSUBISHI MATERIALS CORPORATION
- Marina Sakamaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TERMINAL MATERIAL WITH PLATING FILM AND COPPER SHEET FOR TERMINAL M...
- Publication number 20240396242
- Publication date Nov 28, 2024
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METAL SHEET MATERIAL, LAYERED BODY, INSULATED CIRCUIT BOARD, AND ME...
- Publication number 20240178115
- Publication date May 30, 2024
- MITSUBISHI MATERIALS CORPORATION
- Marina Sakamaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
HEATSINK-INTEGRATED INSULATING CIRCUIT BOARD AND METHOD FOR MANUFAC...
- Publication number 20230411266
- Publication date Dec 21, 2023
- MITSUBISHI MATERIALS CORPORATION
- Yoshiaki Sakaniwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL MATERIAL FOR CONNECTOR
- Publication number 20230299548
- Publication date Sep 21, 2023
- MITSUBISHI MATERIALS CORPORATION
- Yoshie Tarutani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CORROSION-RESISTANT TERMINAL MATERIAL FOR ALUMINUM CORE WIRE, METHO...
- Publication number 20230257897
- Publication date Aug 17, 2023
- MITSUBISHI MATERIALS CORPORATION
- Takashi Tamagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED BODY AND INSULATING CIRCUIT BOARD
- Publication number 20230164924
- Publication date May 25, 2023
- MITSUBISHI MATERIALS CORPORATION
- Marina Sakamaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TERMINAL MATERIAL FOR CONNECTOR
- Publication number 20230111976
- Publication date Apr 13, 2023
- MITSUBISHI MATERIALS CORPORATION
- Yoshie Tarutani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TERMINAL MATERIAL FOR CONNECTORS
- Publication number 20220294140
- Publication date Sep 15, 2022
- MITSUBISHI MATERIALS CORPORATION
- Yoshie Tarutani
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY PLATE, PLATING FILM-ATTACHED COPPER ALLOY PLATE, AND M...
- Publication number 20220081738
- Publication date Mar 17, 2022
- MITSUBISHI MATERIALS CORPORATION
- Naoki Miyashima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ANTI-CORROSION TERMINAL MATERIAL, TERMINAL, AND ELECTRICAL WIRE END...
- Publication number 20220085526
- Publication date Mar 17, 2022
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-CORROSION TERMINAL MATERIAL, ANTI-CORROSION TERMINAL AND ELECT...
- Publication number 20210184380
- Publication date Jun 17, 2021
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TERMINAL MATERIAL WITH SILVER COATING FILM AND TERMINAL WITH SILVER...
- Publication number 20210158990
- Publication date May 27, 2021
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN-PLATED COPPER TERMINAL MATERIAL, TERMINAL, AND WIRE TERMINAL PA...
- Publication number 20200259274
- Publication date Aug 13, 2020
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN-PLATED COPPER TERMINAL MATERIAL, TERMINAL, AND ELECTRIC-WIRE TE...
- Publication number 20200203868
- Publication date Jun 25, 2020
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING HIGH-PURITY ELECTROLYTIC COPPER
- Publication number 20200181788
- Publication date Jun 11, 2020
- MITSUBISHI MATERIALS CORPORATION
- Yoshie Tarutani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN-PLATED COPPER TERMINAL MATERIAL, TERMINAL AND ELECTRIC WIRE TER...
- Publication number 20200173049
- Publication date Jun 4, 2020
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
HIGH-PURITY ELECTROLYTIC COPPER
- Publication number 20200173048
- Publication date Jun 4, 2020
- MITSUBISHI MATERIALS CORPORATION
- Yoshie Tarutani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CORROSION-RESISTANT TERMINAL MATERIAL, CORROSION-RESISTANT TERMINAL...
- Publication number 20200005963
- Publication date Jan 2, 2020
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TERMINAL MATERIAL FOR CONNECTORS, TERMINAL, AND ELECTRIC WIRE TERMI...
- Publication number 20190386415
- Publication date Dec 19, 2019
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TINNED COPPER TERMINAL MATERIAL, TERMINAL, AND ELECTRICAL WIRE END...
- Publication number 20190161866
- Publication date May 30, 2019
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING TIN-PLATED COPPER TERMINAL MATERIAL
- Publication number 20180347062
- Publication date Dec 6, 2018
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ADDITIVE FOR HIGH-PURITY COPPER ELECTROLYTIC REFINING AND METHOD OF...
- Publication number 20170283966
- Publication date Oct 5, 2017
- MITSUBISHI MATERIALS CORPORATION
- Yoshie Tarutani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ADDITIVE FOR HIGH-PURITY COPPER ELECTROLYTIC REFINING AND METHOD OF...
- Publication number 20170283967
- Publication date Oct 5, 2017
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ADDITIVE FOR HIGH-PURITY COPPER ELECTROLYTIC REFINING, METHOD OF PR...
- Publication number 20170088963
- Publication date Mar 30, 2017
- MITSUBISHI MATERIALS CORPORATION
- Yoshie Tarutani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ADDITIVE FOR HIGH-PURITY COPPER ELECTROLYTIC REFINING AND METHOD OF...
- Publication number 20170058412
- Publication date Mar 2, 2017
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN-PLATED COPPER-ALLOY MATERIAL FOR TERMINAL HAVING EXCELLENT INSE...
- Publication number 20140170436
- Publication date Jun 19, 2014
- MITSUBISHI MATERIALS CORPORATION
- Yuki Taninouchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONDUCTIVE MEMBER AND METHOD FOR PRODUCING THE SAME
- Publication number 20140134457
- Publication date May 15, 2014
- Mitsubishi Shindoh Co., Ltd
- Takeshi Sakurai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN-PLATED COPPER-ALLOY MATERIAL FOR TERMINAL AND METHOD FOR PRODUC...
- Publication number 20140004373
- Publication date Jan 2, 2014
- Yuki Taninouchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN-PLATED COPPER-ALLOY MATERIAL FOR TERMINAL AND METHOD FOR PRODUC...
- Publication number 20130196171
- Publication date Aug 1, 2013
- MITSUBISHI MATERIALS CORPORATION
- Yuki Taninouchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Kenji Kubota

Person

Patents Grantslast 30 patents

Bonded body and insulating circuit board

Terminal material for connectors

Copper alloy plate, plating film-attached copper alloy plate, and m...

Terminal material for connector

Method for producing high-purity electrolytic copper

Terminal material for connectors

Anti-corrosion terminal material, anti-corrosion terminal and elect...

Terminal material with silver coating film and terminal with silver...

High-purity electrolytic copper

Tin-plated copper terminal material, terminal, and electric-wire te...

Terminal material for connectors, terminal, and electric wire termi...

Tin-plated copper terminal material, terminal, and wire terminal pa...

Corrosion-resistant terminal material, corrosion-resistant terminal...

Tin-plated copper terminal material, terminal and electric wire ter...

Tinned copper terminal material, terminal, and electrical wire end...

Additive for high-purity copper electrolytic refining and method of...

Additive for high-purity copper electrolytic refining, method of pr...

Additive for high-purity copper electrolytic refining and method of...

Additive for high-purity copper electrolytic refining and method of...

Method of manufacturing tin-plated copper terminal material

Tin-plated copper-alloy material for terminal having excellent inse...

Conductive member and method for producing the same

Tin-plated copper-alloy material for terminal and method for produc...

Conductive member and method for producing the same

Patents Applicationslast 30 patents

BONDED BODY AND INSULATING CIRCUIT BOARD

TERMINAL MATERIAL WITH PLATING FILM AND COPPER SHEET FOR TERMINAL M...

METAL SHEET MATERIAL, LAYERED BODY, INSULATED CIRCUIT BOARD, AND ME...

HEATSINK-INTEGRATED INSULATING CIRCUIT BOARD AND METHOD FOR MANUFAC...

TERMINAL MATERIAL FOR CONNECTOR

CORROSION-RESISTANT TERMINAL MATERIAL FOR ALUMINUM CORE WIRE, METHO...

BONDED BODY AND INSULATING CIRCUIT BOARD

TERMINAL MATERIAL FOR CONNECTOR

TERMINAL MATERIAL FOR CONNECTORS

COPPER ALLOY PLATE, PLATING FILM-ATTACHED COPPER ALLOY PLATE, AND M...

ANTI-CORROSION TERMINAL MATERIAL, TERMINAL, AND ELECTRICAL WIRE END...

ANTI-CORROSION TERMINAL MATERIAL, ANTI-CORROSION TERMINAL AND ELECT...

TERMINAL MATERIAL WITH SILVER COATING FILM AND TERMINAL WITH SILVER...

TIN-PLATED COPPER TERMINAL MATERIAL, TERMINAL, AND WIRE TERMINAL PA...

TIN-PLATED COPPER TERMINAL MATERIAL, TERMINAL, AND ELECTRIC-WIRE TE...

METHOD FOR PRODUCING HIGH-PURITY ELECTROLYTIC COPPER

TIN-PLATED COPPER TERMINAL MATERIAL, TERMINAL AND ELECTRIC WIRE TER...

HIGH-PURITY ELECTROLYTIC COPPER

CORROSION-RESISTANT TERMINAL MATERIAL, CORROSION-RESISTANT TERMINAL...

TERMINAL MATERIAL FOR CONNECTORS, TERMINAL, AND ELECTRIC WIRE TERMI...

TINNED COPPER TERMINAL MATERIAL, TERMINAL, AND ELECTRICAL WIRE END...

METHOD OF MANUFACTURING TIN-PLATED COPPER TERMINAL MATERIAL

ADDITIVE FOR HIGH-PURITY COPPER ELECTROLYTIC REFINING AND METHOD OF...

ADDITIVE FOR HIGH-PURITY COPPER ELECTROLYTIC REFINING AND METHOD OF...

ADDITIVE FOR HIGH-PURITY COPPER ELECTROLYTIC REFINING, METHOD OF PR...

ADDITIVE FOR HIGH-PURITY COPPER ELECTROLYTIC REFINING AND METHOD OF...

TIN-PLATED COPPER-ALLOY MATERIAL FOR TERMINAL HAVING EXCELLENT INSE...

CONDUCTIVE MEMBER AND METHOD FOR PRODUCING THE SAME

TIN-PLATED COPPER-ALLOY MATERIAL FOR TERMINAL AND METHOD FOR PRODUC...

TIN-PLATED COPPER-ALLOY MATERIAL FOR TERMINAL AND METHOD FOR PRODUC...