Kenji Kubozono

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Sagamihara, JP

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Patents Grantslast 30 patents

Information Patent Grant
Copper alloy for electronic parts, lead-frame, semiconductor device...
- Patent number 5,833,920
- Issue date Nov 10, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Teruo Nakanishi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper Ni-Si-P alloy for an electronic device
- Patent number 5,248,351
- Issue date Sep 28, 1993
- Mitsubishi Denki Kabushiki Kaisha
- Kenji Kubozono
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Cu-Ni-Sn alloy with excellent fatigue properties
- Patent number 5,028,282
- Issue date Jul 2, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Kenji Kubozono
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method for producing high strength Cu-Ni-Sn alloy containing manganese
- Patent number 5,019,185
- Issue date May 28, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Takashi Nakajima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper alloy for an electronic device and method of preparing the same
- Patent number 4,950,451
- Issue date Aug 21, 1990
- Mitsubishi Denki Kabushiki Kaisha
- Takashi Nakajima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...