Kenji Kume

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Shiga, JP

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Patents Grantslast 30 patents

Information Patent Grant
Resin film, adhesive sheet, circuit board, and electronic apparatus
- Patent number 8,129,623
- Issue date Mar 6, 2012
- Kyocera Corporation
- Tadashi Nagasawa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multi-layer wiring substrate
- Patent number 6,663,946
- Issue date Dec 16, 2003
- Kyocera Corporation
- Takuji Seri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Resin Film, Adhesive Sheet, Circuit Board, and Electronic Apparatus
- Publication number 20090314526
- Publication date Dec 24, 2009
- KYOCERA CORPORATION
- Tadashi Nagasawa
- B32 - LAYERED PRODUCTS
Information Patent Application
Multi-layer wiring substrate
- Publication number 20020172021
- Publication date Nov 21, 2002
- Takuji Seri
- H01 - BASIC ELECTRIC ELEMENTS