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Kenji Matsuda
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Osaka, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Moisture-curable hot melt adhesive
Patent number
11,236,257
Issue date
Feb 1, 2022
Henkel AG & Co. KGaA
Kenji Matsuda
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Hot melt adhesive agent for container with straw
Patent number
11,149,170
Issue date
Oct 19, 2021
Henkel AG & Co. KGaA
Kenji Matsuda
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Adhesive sheet
Patent number
10,919,264
Issue date
Feb 16, 2021
Henkel AG & Co. KGaA
Ai Takamori
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Hot-melt adhesive for electric instruments
Patent number
9,550,922
Issue date
Jan 24, 2017
Henkel IP & Holding GmbH
Itsuro Tomatsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
LED lighting device and illumination apparatus including same
Patent number
8,723,436
Issue date
May 13, 2014
Panasonic Corporation
Koji Watanabe
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Lighting driver circuit and light fixture
Patent number
8,680,775
Issue date
Mar 25, 2014
Panasonic Corporation
Kenji Matsuda
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Dimming electronic ballast with preheat current control
Patent number
8,294,384
Issue date
Oct 23, 2012
Panasonic Corporation
Kenji Matsuda
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Moisture-Curable Hot-Melt Adhesive Agent
Publication number
20200095471
Publication date
Mar 26, 2020
Henkel AG & Co. KGaA
Kenji Matsuda
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Moisture-Curable Hot-Melt Adhesive Agent
Publication number
20200087542
Publication date
Mar 19, 2020
Henkel AG & Co. KGaA
Kenji Matsuda
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Moisture-Curable Hot-Melt Adhesive Agent
Publication number
20200087543
Publication date
Mar 19, 2020
Henkel AG & Co. KGaA
Kenji Matsuda
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
HOT MELT ADHESIVE AGENT FOR CONTAINER WITH STRAW
Publication number
20190185718
Publication date
Jun 20, 2019
Henkel AG & Co. KGaA
Kenji Matsuda
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
Moisture-Curable Hot Melt Adhesive
Publication number
20180298254
Publication date
Oct 18, 2018
Kenji Matsuda
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
HOT-MELT ADHESIVE FOR ELECTRIC INSTRUMENTS
Publication number
20150045509
Publication date
Feb 12, 2015
Henkel AG & Co. KGaA
Itsuro Tomatsu
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
ADHESIVE SHEET
Publication number
20150037596
Publication date
Feb 5, 2015
Henkel AG & Co. KGaA
Ai Takamori
B32 - LAYERED PRODUCTS
Information
Patent Application
LIGHTING DRIVER CIRCUIT AND LIGHT FIXTURE
Publication number
20120293087
Publication date
Nov 22, 2012
Kenji Matsuda
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
LED LIGHTING DEVICE AND ILLUMINATION APPARATUS INCLUDING SAME
Publication number
20120212148
Publication date
Aug 23, 2012
PANASONIC CORPORATION
Koji WATANABE
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
DIMMING ELECTRONIC BALLAST WITH PREHEAT CURRENT CONTROL
Publication number
20100109548
Publication date
May 6, 2010
Kenji Matsuda
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR