Kenji MATSUDA

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Nirasaki-shi Yamanashi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and heat-dissipating mechanism
- Patent number 9,607,922
- Issue date Mar 28, 2017
- Tanaka Kikinzoku Kogyo K.K.
- Kenji Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,716,130
- Issue date May 6, 2014
- Tokyo Electron Limited
- Kippei Sugita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND HEAT-DISSIPATING MECHANISM
- Publication number 20160049350
- Publication date Feb 18, 2016
- Tanaka Kikinzoku Kogyo K.K.
- Kenji MATSUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SINTERED SILVER COATING FILM, BAKING APPARATUS,...
- Publication number 20140239484
- Publication date Aug 28, 2014
- TOKYO ELECTRON LIMITED
- Kenji MATSUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20130089983
- Publication date Apr 11, 2013
- TOKYO ELECTRON LIMITED
- Kippei Sugita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-Shaped Measuring Apparatus and Method for Manufacturing the Same
- Publication number 20090085031
- Publication date Apr 2, 2009
- TOKYO ELECTRON LIMITED
- Kenji Matsuda
- G01 - MEASURING TESTING
Information Patent Application
Capacitor and manufacturing method thereof
- Publication number 20070181556
- Publication date Aug 9, 2007
- Yoshiki Yamanishi
- H01 - BASIC ELECTRIC ELEMENTS