Kenji MEGURO

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Nagano, JP

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Patents Grantslast 30 patents

Information Patent Grant
Heat treatment method for semiconductor wafer
- Patent number 10,763,127
- Issue date Sep 1, 2020
- Shin-Etsu Handotai Co., Ltd.
- Taishi Wakabayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonded SOI wafer
- Patent number 10,566,196
- Issue date Feb 18, 2020
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a bonded SOI wafer and bonded SOI wafer
- Patent number 10,529,615
- Issue date Jan 7, 2020
- Shin-Etsu Handotai Co., Ltd.
- Kenji Meguro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a bonded SOI wafer
- Patent number 10,460,983
- Issue date Oct 29, 2019
- SHIN-ETSU HANDOTAI CO.,LTD.
- Taishi Wakabayashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEAT TREATMENT METHOD FOR SEMICONDUCTOR WAFER
- Publication number 20190035639
- Publication date Jan 31, 2019
- Shin-Etsu Handotai Co., Ltd.
- Taishi WAKABAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING BONDED SOI WAFER
- Publication number 20180122639
- Publication date May 3, 2018
- Shin-Etsu Handotai Co., Ltd.
- Norihiro KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A BONDED SOI WAFER
- Publication number 20170040210
- Publication date Feb 9, 2017
- Shin-Etsu Handotai Co., Ltd.
- Taishi WAKABAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A BONDED SOI WAFER AND BONDED SOI WAFER
- Publication number 20170033002
- Publication date Feb 2, 2017
- Shin-Etsu Handotai Co., Ltd.
- Kenji MEGURO
- B32 - LAYERED PRODUCTS