Kenji Nagase

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Multilayer wiring board and manufacturing method thereof
- Patent number 8,591,750
- Issue date Nov 26, 2013
- TDK Corporation
- Hiroyuki Uematsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and manufacturing method therefor
- Patent number 8,492,659
- Issue date Jul 23, 2013
- TDK Corporation
- Kenji Nagase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring structure of printed wiring board and method for manufacturi...
- Patent number 8,227,710
- Issue date Jul 24, 2012
- TDK Corporation
- Kenji Nagase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing IC-embedded substrate
- Patent number 7,761,982
- Issue date Jul 27, 2010
- TDK Corporation
- Kenji Nagase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Multilayer wiring board and manufacturing method thereof
- Publication number 20100243601
- Publication date Sep 30, 2010
- TDK Corporation
- Hiroyuki Uematsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing printed wiring board
- Publication number 20100065194
- Publication date Mar 18, 2010
- TDK Corporation
- Kenji Nagase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board and manufacturing method therefor
- Publication number 20090211799
- Publication date Aug 27, 2009
- TDK Corporation
- Kenji Nagase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring structure, forming method of the same and printed wiring board
- Publication number 20080202803
- Publication date Aug 28, 2008
- TDK Corporation
- Kenji Nagase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring structure of printed wiring board and method for manufacturi...
- Publication number 20080149379
- Publication date Jun 26, 2008
- TDK Corporation
- Kenji Nagase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING IC-EMBEDDED SUBSTRATE
- Publication number 20070141759
- Publication date Jun 21, 2007
- TDK Corporation
- Kenji Nagase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR