Kenji Nakamura

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Nagano-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of plating for filling via holes
- Patent number 6,755,957
- Issue date Jun 29, 2004
- Shinko Electric Industries Co., Ltd.
- Kenji Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method of copper plating small diameter hole
- Publication number 20040011654
- Publication date Jan 22, 2004
- Kenji Nakamura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of plating for filling via holes
- Publication number 20010013472
- Publication date Aug 16, 2001
- Kenji Nakamura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR