Kenji Nishikawa

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Measurement result receiving apparatus, measuring apparatus, and me...
- Patent number 11,902,813
- Issue date Feb 13, 2024
- Advantest Corporation
- Takashi Fujisaki
- G08 - SIGNALLING
Information Patent Grant
Side milling cutter for slot cutting
- Patent number 9,919,365
- Issue date Mar 20, 2018
- Misubishi Hitachi Power Systems, Ltd.
- Takayuki Miyamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor device, and semiconductor de...
- Patent number 9,741,641
- Issue date Aug 22, 2017
- Renesas Electronics Corporation
- Akito Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Opening and closing device for access port that opens to working pl...
- Patent number 9,601,221
- Issue date Mar 21, 2017
- Mitsubishi Heavy Industries, Ltd.
- Atsushi Sugiura
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Grant
Nozzle stub working system for reactor vessel
- Patent number 9,524,803
- Issue date Dec 20, 2016
- Mitsubishi Heavy Industries, Ltd.
- Atsushi Sugiura
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Grant
Method for manufacturing semiconductor device, and semiconductor de...
- Patent number 9,293,396
- Issue date Mar 22, 2016
- Renesas Electronics Corporation
- Akito Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,257,400
- Issue date Feb 9, 2016
- Renesas Electronics Corporation
- Shinichi Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe, semiconductor device, and method of manufacturing the same
- Patent number 9,029,195
- Issue date May 12, 2015
- Renesas Electronics Corporation
- Kenji Nishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device, and semiconductor de...
- Patent number 9,018,745
- Issue date Apr 28, 2015
- Renesas Corporation
- Akito Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe, semiconductor device, and method of manufacturing the same
- Patent number 8,786,112
- Issue date Jul 22, 2014
- Renesas Electronics Corporation
- Kenji Nishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die pad package with a concave portion in the sealing resin
- Patent number 8,598,693
- Issue date Dec 3, 2013
- Renesas Electronics Corporation
- Kenji Nishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe, semiconductor device, and method of manufacturing the same
- Patent number 8,487,454
- Issue date Jul 16, 2013
- Renesas Electronics Corporation
- Kenji Nishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe, semiconductor device, and method of manufacturing the same
- Patent number 8,164,203
- Issue date Apr 24, 2012
- Renesas Electronics Corporation
- Kenji Nishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device method and program for measuring polarization mode dispersio...
- Patent number 7,126,679
- Issue date Oct 24, 2006
- Advantest Corporation
- Kenji Nishikawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Drinking water dispenser
- Patent number 6,207,046
- Issue date Mar 27, 2001
- Suntory Limited
- Tomohiro Yamashita
- B67 - OPENING, CLOSING OR CLEANING BOTTLES, JARS OR SIMILAR CONTAINERS LIQUID...
Information Patent Grant
Transparent liquid container bottle with tinted label and base cup
- Patent number 4,658,974
- Issue date Apr 21, 1987
- Suntory Limited
- Takashi Fujita
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Patents Applicationslast 30 patents

Information Patent Application
Tool Wear Monitoring Device, Tool Wear Monitoring System, and Program
- Publication number 20230008435
- Publication date Jan 12, 2023
- Hitachi, Ltd
- Kenji NISHIKAWA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Tool State Detection System
- Publication number 20220097192
- Publication date Mar 31, 2022
- Hitachi, Ltd
- Kenji NISHIKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEASUREMENT RESULT RECEIVING APPARATUS, MEASURING APPARATUS, AND ME...
- Publication number 20220038930
- Publication date Feb 3, 2022
- Advantest Corporation
- Takashi FUJISAKI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICES WITH SHIELD
- Publication number 20200402919
- Publication date Dec 24, 2020
- J-DEVICES CORPORATION
- Yoshio Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DE...
- Publication number 20170309547
- Publication date Oct 26, 2017
- RENESAS ELECTRONICS CORPORATION
- Akito SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DE...
- Publication number 20160133548
- Publication date May 12, 2016
- RENESAS ELECTRONICS CORPORATION
- Akito SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160111357
- Publication date Apr 21, 2016
- RENESAS ELECTRONICS CORPORATION
- Shinichi UCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DE...
- Publication number 20150194368
- Publication date Jul 9, 2015
- RENESAS ELECTRONICS CORPORATION
- Akito Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Side Milling Cutter for Slot Cutting
- Publication number 20150165531
- Publication date Jun 18, 2015
- Mitsubishi Hitachi Power Systems, Ltd.
- Takayuki MIYAMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150084209
- Publication date Mar 26, 2015
- RENESAS ELECTRONICS CORPORATION
- Shinichi UCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140242734
- Publication date Aug 28, 2014
- RENESAS ELECTRONICS CORPORATION
- Kenji Nishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DE...
- Publication number 20140001620
- Publication date Jan 2, 2014
- RENESAS ELECTRONICS CORPORATION
- Akito Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130285227
- Publication date Oct 31, 2013
- RENESAS ELECTRONICS CORPORATION
- Kenji Nishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120175760
- Publication date Jul 12, 2012
- RENESAS ELECTRONICS CORPORATION
- Kenji NISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20120032316
- Publication date Feb 9, 2012
- RENESAS ELECTRONICS CORPORATION
- Kenji NISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOZZLE STUB WORKING SYSTEM FOR REACTOR VESSEL
- Publication number 20120027154
- Publication date Feb 2, 2012
- Mitsubishi Heavy Industries, Ltd.
- Atsushi Sugiura
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Application
OPENING AND CLOSING DEVICE FOR ACCESS PORT THAT OPENS TO WORKING PL...
- Publication number 20120027153
- Publication date Feb 2, 2012
- Mitsubishi Heavy Industries, Ltd.
- Atsushi Sugiura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor package, lead frame, and wiring board with the same
- Publication number 20100290202
- Publication date Nov 18, 2010
- Renesas Electronics Corporation
- Hideki Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe, semiconductor device, and method of manufacturing the same
- Publication number 20100025839
- Publication date Feb 4, 2010
- NEC Electronics Corporation
- Kenji Nishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device method and program for measuring polarization mode dispersio...
- Publication number 20050225746
- Publication date Oct 13, 2005
- Kenji Nishikawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Kenji Nishikawa

Person

Patents Grantslast 30 patents

Measurement result receiving apparatus, measuring apparatus, and me...

Side milling cutter for slot cutting

Method for manufacturing semiconductor device, and semiconductor de...

Opening and closing device for access port that opens to working pl...

Nozzle stub working system for reactor vessel

Method for manufacturing semiconductor device, and semiconductor de...

Semiconductor device

Leadframe, semiconductor device, and method of manufacturing the same

Method for manufacturing semiconductor device, and semiconductor de...

Leadframe, semiconductor device, and method of manufacturing the same

Die pad package with a concave portion in the sealing resin

Leadframe, semiconductor device, and method of manufacturing the same

Leadframe, semiconductor device, and method of manufacturing the same

Device method and program for measuring polarization mode dispersio...

Drinking water dispenser

Transparent liquid container bottle with tinted label and base cup

Patents Applicationslast 30 patents

Tool Wear Monitoring Device, Tool Wear Monitoring System, and Program

Tool State Detection System

MEASUREMENT RESULT RECEIVING APPARATUS, MEASURING APPARATUS, AND ME...

SEMICONDUCTOR DEVICES WITH SHIELD

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DE...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DE...

Side Milling Cutter for Slot Cutting

SEMICONDUCTOR DEVICE

LEADFRAME, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DE...

LEADFRAME, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME

LEADFRAME, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...

NOZZLE STUB WORKING SYSTEM FOR REACTOR VESSEL

OPENING AND CLOSING DEVICE FOR ACCESS PORT THAT OPENS TO WORKING PL...

Semiconductor package, lead frame, and wiring board with the same

Leadframe, semiconductor device, and method of manufacturing the same

Device method and program for measuring polarization mode dispersio...