Kenji Ohsawa

Person

Kagoshima-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Cooling device and electronic device
- Patent number 9,240,365
- Issue date Jan 19, 2016
- Molex, LLC
- Kenji Ohsawa
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat sink package and method of manufacturing
- Patent number 8,988,882
- Issue date Mar 24, 2015
- Molex Japan Co., Ltd.
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink, cooling module and coolable electronic board
- Patent number 8,982,559
- Issue date Mar 17, 2015
- Fuchigami Micro Co., Ltd.
- Kenji Ohsawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat pipe and circuit board with a heat pipe function
- Patent number 8,611,089
- Issue date Dec 17, 2013
- Fuchigami Micro Co., Ltd.
- Kei Mizuta
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat pipe and method for manufacturing same
- Patent number 8,534,348
- Issue date Sep 17, 2013
- Molex Incorporated
- Kenji Ohsawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HEAT PIPE AND METHOD FOR MANUFACTURING SAME
- Publication number 20210310745
- Publication date Oct 7, 2021
- Fuchigami Micro Co., Ltd
- Kenji Ohsawa
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT PIPE
- Publication number 20130269913
- Publication date Oct 17, 2013
- Molex Incorporated
- Susumu Ueda
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT TRANSPORTING UNIT, ELECTRONIC CIRCUIT BOARD AND ELECTRONIC DEVICE
- Publication number 20130126139
- Publication date May 23, 2013
- Molex Incorporated
- Katsuya Tsuruta
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT TRANSPORTING UNIT AND ELECTRONIC DEVICE
- Publication number 20120211207
- Publication date Aug 23, 2012
- Molex Incorporated
- Kenji Ohsawa
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT SINK PACKAGE AND METHOD OF MANUFACTURING
- Publication number 20120127667
- Publication date May 24, 2012
- Kagoshima University
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Pipe, Method For Manufacturing A Heat Pipe, And A Circuit Boar...
- Publication number 20120106084
- Publication date May 3, 2012
- Kagoshima University
- Kei Mizuta
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COOLING DEVICE AND ELECTRONIC DEVICE
- Publication number 20120002370
- Publication date Jan 5, 2012
- Molex Incorporated
- Kenji Ohsawa
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Heat Sink, Cooling Module And Coolable Electronic Board
- Publication number 20110214904
- Publication date Sep 8, 2011
- Fuchigami Micro Co., Ltd
- Kenji Ohsawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat Pipe and Method for Manufacturing Same
- Publication number 20080135214
- Publication date Jun 12, 2008
- FUCHIGAMI MICRO CO., LTD.
- Kenji Ohsawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat pipe and method for manufacturing same
- Publication number 20070056711
- Publication date Mar 15, 2007
- Fuchigami Mirco Co., Ltd.
- Kenji Ohsawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Kenji Ohsawa

Person

Patents Grantslast 30 patents

Cooling device and electronic device

Heat sink package and method of manufacturing

Heat sink, cooling module and coolable electronic board

Heat pipe and circuit board with a heat pipe function

Heat pipe and method for manufacturing same

Patents Applicationslast 30 patents

HEAT PIPE AND METHOD FOR MANUFACTURING SAME

HEAT PIPE

HEAT TRANSPORTING UNIT, ELECTRONIC CIRCUIT BOARD AND ELECTRONIC DEVICE

HEAT TRANSPORTING UNIT AND ELECTRONIC DEVICE

HEAT SINK PACKAGE AND METHOD OF MANUFACTURING

Heat Pipe, Method For Manufacturing A Heat Pipe, And A Circuit Boar...

COOLING DEVICE AND ELECTRONIC DEVICE

Heat Sink, Cooling Module And Coolable Electronic Board

Heat Pipe and Method for Manufacturing Same

Heat pipe and method for manufacturing same