Kenji Okazaki

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wafer processing method
- Patent number 12,094,776
- Issue date Sep 17, 2024
- Disco Corporation
- Susumu Yokoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing wafer
- Patent number 10,177,004
- Issue date Jan 8, 2019
- Disco Corporation
- Yoshio Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method for workpiece
- Patent number 10,115,636
- Issue date Oct 30, 2018
- Disco Corporation
- Yoshiteru Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching apparatus
- Patent number 9,653,357
- Issue date May 16, 2017
- Disco Corporation
- Junichi Arami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method
- Patent number 9,330,976
- Issue date May 3, 2016
- Disco Corporation
- Susumu Yakoo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20220102215
- Publication date Mar 31, 2022
- Disco Corporation
- Susumu YOKOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING WAFER
- Publication number 20180269068
- Publication date Sep 20, 2018
- Disco Corporation
- Yoshio Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD FOR WORKPIECE
- Publication number 20160042962
- Publication date Feb 11, 2016
- Disco Corporation
- Yoshiteru Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20160042996
- Publication date Feb 11, 2016
- Disco Corporation
- Susumu Yakoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ETCHING APPARATUS
- Publication number 20150020973
- Publication date Jan 22, 2015
- Disco Corporation
- Junichi Arami
- H01 - BASIC ELECTRIC ELEMENTS