Kenji OONISHI

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Die bond film, dicing die bond film, and semiconductor device
- Patent number 8,779,586
- Issue date Jul 15, 2014
- Nitto Denko Corporation
- Kenji Oonishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
THERMOSETTING DIE-BONDING FILM
- Publication number 20120153508
- Publication date Jun 21, 2012
- NITTO DENKO CORPORATION
- Miki Hayashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DIE BOND FILM, DICING DIE BOND FILM, AND SEMICONDUCTOR DEVICE
- Publication number 20110210455
- Publication date Sep 1, 2011
- Kenji Oonishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE COMPOSITION FOR PRODUCING SEMICONDUCTOR DEVICE, AND ADHESI...
- Publication number 20110190421
- Publication date Aug 4, 2011
- Yuta KIMURA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING ADHESIVE FILM, ADHESIVE FILM WITH DICING FILM, AND ME...
- Publication number 20110120614
- Publication date May 26, 2011
- Yuki Sugo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING DIE BONDING FILM, DICING DIE BONDING FILM AND SEMICON...
- Publication number 20110057331
- Publication date Mar 10, 2011
- Miki Hayashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE
- Publication number 20100314782
- Publication date Dec 16, 2010
- Nitto Denko Corporation
- Kenji OONISHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Kenji OONISHI

Person

Patents Grantslast 30 patents

Die bond film, dicing die bond film, and semiconductor device

Patents Applicationslast 30 patents

THERMOSETTING DIE-BONDING FILM

DIE BOND FILM, DICING DIE BOND FILM, AND SEMICONDUCTOR DEVICE

ADHESIVE COMPOSITION FOR PRODUCING SEMICONDUCTOR DEVICE, AND ADHESI...

THERMOSETTING ADHESIVE FILM, ADHESIVE FILM WITH DICING FILM, AND ME...

THERMOSETTING DIE BONDING FILM, DICING DIE BONDING FILM AND SEMICON...

DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE