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Kenji Otoda
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Osaka, JP
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Patents Grants
last 30 patents
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Patent Grant
Device and method for cutting off substrate of fragile material
Patent number
8,276,796
Issue date
Oct 2, 2012
Mitsuboshi Diamond Industrial Co., Ltd.
Yuki Nishisaka
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Patents Applications
last 30 patents
Information
Patent Application
DEVICE AND METHOD FOR CUTTING OFF SUBSTRATE OF FRAGILE MATERIAL
Publication number
20100065599
Publication date
Mar 18, 2010
MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.
Yuki Nishisaka
B28 - WORKING CEMENT, CLAY, OR STONE
Information
Patent Application
METHOD AND APPARATUS FOR SCRIBING BRITTLE MATERIAL BOARD AND SYSTEM...
Publication number
20090050610
Publication date
Feb 26, 2009
MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.
Kiyoshi Takamatsu
B28 - WORKING CEMENT, CLAY, OR STONE
Information
Patent Application
Method of Scribing and Breaking Substrate Made of a Brittle Materia...
Publication number
20080305615
Publication date
Dec 11, 2008
MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.
Tsutomu Ueno
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Patent Application
Brittle substrate cutting system and brittle substrate cutting method
Publication number
20070051769
Publication date
Mar 8, 2007
MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.
Kenji Otoda
G02 - OPTICS