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Wafer polishing apparatus
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Patent number 6,354,914
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Issue date Mar 12, 2002
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Tokyo Seimitsu Co., Ltd.
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Takao Inaba
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B24 - GRINDING POLISHING
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Wafer polishing machine
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Patent number 6,346,037
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Issue date Feb 12, 2002
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Tokyo Seimitsu Co., Ltd.
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Takao Inaba
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B24 - GRINDING POLISHING
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Wafer polishing apparatus
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Patent number 6,302,762
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Issue date Oct 16, 2001
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Tokyo Seimitsu Co., Ltd.
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Takao Inaba
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B24 - GRINDING POLISHING
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Polishing apparatus
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Patent number 6,203,414
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Issue date Mar 20, 2001
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Tokyo Seimitsu Co., Ltd.
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Minoru Numoto
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B24 - GRINDING POLISHING
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Wafer polishing apparatus
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Patent number 6,059,636
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Issue date May 9, 2000
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Tokyo Seimitsu Co., Ltd.
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Takao Inaba
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B24 - GRINDING POLISHING
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Wafer polishing apparatus
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Patent number 6,027,398
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Issue date Feb 22, 2000
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Tokyo Seimitsu Co., Ltd.
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Minoru Numoto
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B24 - GRINDING POLISHING
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Wafer polishing machine
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Patent number 5,931,725
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Issue date Aug 3, 1999
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Tokyo Seimitsu Co., Ltd.
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Takao Inaba
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B24 - GRINDING POLISHING
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Cap for writing equipment
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Patent number 4,844,642
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Issue date Jul 4, 1989
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Pilot Ink Co., Ltd.
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Takao Inaba
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B43 - WRITING OR DRAWING IMPLEMENTS BUREAU ACCESSORIES
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