Kenji Sakimae

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Yamagata, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method for producing heat-radiating subst...
- Patent number 6,926,861
- Issue date Aug 9, 2005
- Tokyo Tungsten Co., Ltd.
- Norio Hirayama
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor package and method for producing heat-radiating subst...
- Patent number 6,693,353
- Issue date Feb 17, 2004
- Tokyo Tungsten Co., Ltd.
- Norio Hirayama
- B22 - CASTING POWDER METALLURGY

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor package and method for producing heat-radiating subst...
- Publication number 20040056352
- Publication date Mar 25, 2004
- TOKYO TUNGSTEN CO., LTD.
- Norio Hirayama
- B22 - CASTING POWDER METALLURGY