Kenji Sasaoka

Person

Zama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Component built-in wiring board and manufacturing method of compone...
- Patent number 8,987,901
- Issue date Mar 24, 2015
- Dai Nippon Printing Co., Ltd.
- Kenji Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board with a built-in component and method for manufacturing...
- Patent number 8,737,085
- Issue date May 27, 2014
- Dai Nippon Printing Co., Ltd.
- Kenji Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component built-in wiring board and manufacturing method of compone...
- Patent number 8,350,388
- Issue date Jan 8, 2013
- Dai Nippon Printing Co., Ltd.
- Kenji Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component built-in wiring board and method for radiating...
- Patent number 8,198,541
- Issue date Jun 12, 2012
- Dai Nippon Printing Co., Ltd.
- Kenji Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component built-in wiring board and manufacturing method of compone...
- Patent number 7,644,497
- Issue date Jan 12, 2010
- Dai Nippon Printing Co., Ltd.
- Tatsuro Imamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for manufacturing a wiring board
- Patent number 7,526,859
- Issue date May 5, 2009
- Dai Nippon Printing Co., Ltd.
- Kenji Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component built-in wiring board and manufacturing method of compone...
- Patent number 7,345,888
- Issue date Mar 18, 2008
- Dai Nippon Printing Co., Ltd.
- Tatsuro Imamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board incorporating components and process for producing the...
- Patent number 7,242,591
- Issue date Jul 10, 2007
- Dai Nippon Printing Co., Ltd.
- Tatsuro Imamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a wiring board
- Patent number 7,134,193
- Issue date Nov 14, 2006
- Dai Nippon Printing Co., Ltd.
- Kenji Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for manufacturing a wiring board
- Patent number 6,865,801
- Issue date Mar 15, 2005
- Kabushiki Kaisha Toshiba
- Kenji Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and printed wiring board for semiconductor pa...
- Patent number 6,534,873
- Issue date Mar 18, 2003
- Kabushiki Kaisha Toshiba
- Yoshizumi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for manufacturing a wiring substrate
- Patent number 6,507,995
- Issue date Jan 21, 2003
- Kabushiki Kaisha Toshiba
- Kenji Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, wiring board fabrication method, and semiconductor pa...
- Patent number 6,353,189
- Issue date Mar 5, 2002
- Kabushiki Kaisha Toshiba
- Osamu Shimada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board and method for forming the same
- Patent number 6,010,769
- Issue date Jan 4, 2000
- Kabushiki Kaisha Toshiba
- Kenji Sasaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit devices and fabrication Method of the same
- Patent number 5,822,850
- Issue date Oct 20, 1998
- Kabushiki Kaisha Toshiba
- Hiroshi Odaira
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit devices and fabrication method of the same
- Patent number 5,600,103
- Issue date Feb 4, 1997
- Kabushiki Kaisha Toshiba
- Hiroshi Odaira
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COMPONENT BUILT-IN WIRING BOARD AND MANUFACTURING METHOD OF COMPONE...
- Publication number 20130082370
- Publication date Apr 4, 2013
- DAI NIPPON PRINTING CO., LTD.
- Kenji Sasaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT BUILT-IN WIRING BOARD AND MANUFACTURING METHOD OF COMPONE...
- Publication number 20100301473
- Publication date Dec 2, 2010
- DAI NIPPON PRINTING CO., LTD.
- Kenji Sasaoka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC COMPONENT BUILT-IN WIRING BOARD AND METHOD FOR RADIATING...
- Publication number 20100025082
- Publication date Feb 4, 2010
- Kenji Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD WITH A BUILT-IN COMPONENT AND METHOD FOR MANUFACTURING...
- Publication number 20090107715
- Publication date Apr 30, 2009
- DAI NIPPON PRINTING CO. LTD.
- Kenji Sasaoka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Component built-in wiring board and manufacturing method of compone...
- Publication number 20080163486
- Publication date Jul 10, 2008
- DAI NIPPON PRINTING CO., LTD.
- Tatsuro Imamura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Component built-in wiring board and manufacturing method of compone...
- Publication number 20070195511
- Publication date Aug 23, 2007
- DAI NIPPON PRINTING CO., LTD.
- Tatsuro Imamura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Apparatus for manufacturing a wiring board and method for manufactu...
- Publication number 20070044294
- Publication date Mar 1, 2007
- DAI NIPPON PRINTING CO., LTD.
- Kenji Sasaoka
- B32 - LAYERED PRODUCTS
Information Patent Application
Wiring board incorporating components and process for producing the...
- Publication number 20060154496
- Publication date Jul 13, 2006
- Tatsuro Imamura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Apparatus for manufacturing a wiring board and method for manufactu...
- Publication number 20050115068
- Publication date Jun 2, 2005
- Kabushiki Kaisha Toshiba
- Kenji Sasaoka
- B32 - LAYERED PRODUCTS
Information Patent Application
Apparatus for manufacturing a wiring board and method for manufactu...
- Publication number 20010039720
- Publication date Nov 15, 2001
- Kabushiki Kaisha Toshiba
- Kenji Sasaoka
- B32 - LAYERED PRODUCTS

Kenji Sasaoka

Person

Patents Grantslast 30 patents

Component built-in wiring board and manufacturing method of compone...

Wiring board with a built-in component and method for manufacturing...

Component built-in wiring board and manufacturing method of compone...

Electronic component built-in wiring board and method for radiating...

Component built-in wiring board and manufacturing method of compone...

Apparatus for manufacturing a wiring board

Component built-in wiring board and manufacturing method of compone...

Wiring board incorporating components and process for producing the...

Method for manufacturing a wiring board

Apparatus for manufacturing a wiring board

Semiconductor package and printed wiring board for semiconductor pa...

Apparatus for manufacturing a wiring substrate

Wiring board, wiring board fabrication method, and semiconductor pa...

Multilayer wiring board and method for forming the same

Circuit devices and fabrication Method of the same

Circuit devices and fabrication method of the same

Patents Applicationslast 30 patents

COMPONENT BUILT-IN WIRING BOARD AND MANUFACTURING METHOD OF COMPONE...

COMPONENT BUILT-IN WIRING BOARD AND MANUFACTURING METHOD OF COMPONE...

ELECTRONIC COMPONENT BUILT-IN WIRING BOARD AND METHOD FOR RADIATING...

WIRING BOARD WITH A BUILT-IN COMPONENT AND METHOD FOR MANUFACTURING...

Component built-in wiring board and manufacturing method of compone...

Component built-in wiring board and manufacturing method of compone...

Apparatus for manufacturing a wiring board and method for manufactu...

Wiring board incorporating components and process for producing the...

Apparatus for manufacturing a wiring board and method for manufactu...

Apparatus for manufacturing a wiring board and method for manufactu...