Kenji Satomura

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Nagasaki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor wafer manufacturing method
- Patent number 8,545,712
- Issue date Oct 1, 2013
- Sumco Techxiv Corporation
- Hiroshi Takai
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
DEVICE FOR POLISHING OUTER PERIPHERY OF WAFER
- Publication number 20230211449
- Publication date Jul 6, 2023
- SUMCO CORPORATION
- Kenji SATOMURA
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR WAFER MANUFACTURING METHOD
- Publication number 20100285665
- Publication date Nov 11, 2010
- SUMCO TECHXIV CORPORATION
- Hiroshi Takai
- B24 - GRINDING POLISHING