Kenji Shimokawa

Person

Chiba, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Ball transferring method and apparatus
- Patent number 7,285,486
- Issue date Oct 23, 2007
- Nippon Steel Materials Co., Ltd.
- Kenji Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating a semiconductor devices provided with low me...
- Patent number 7,045,389
- Issue date May 16, 2006
- Nippon Steel Corporation
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device provided with low melting point metal bumps
- Patent number 7,045,388
- Issue date May 16, 2006
- Nippon Steel Corporation
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball transferring method and apparatus
- Patent number 6,916,731
- Issue date Jul 12, 2005
- Nippon Steel Corporation
- Kenji Shimokawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spherical semiconductor device and method for fabricating the same
- Patent number 6,909,182
- Issue date Jun 21, 2005
- Nippon Steel Corporation
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of partially plating substrate for electronic devices
- Patent number 6,884,708
- Issue date Apr 26, 2005
- Nippon Steel Corporation
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball-arranging substrate for forming bump, ball-arranging head, bal...
- Patent number 6,571,007
- Issue date May 27, 2003
- Nippon Steel Corporation
- Kenji Shimokawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spherical semiconductor device and method for fabricating the same
- Patent number 6,509,645
- Issue date Jan 21, 2003
- Nippon Steel Corporation
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer of flux onto electrodes and production of bumps on electrodes
- Patent number 5,899,376
- Issue date May 4, 1999
- Nippon Steel Corporation
- Kouhei Tatumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Production of small metal bumps
- Patent number 5,765,744
- Issue date Jun 16, 1998
- Nippon Steel Corporation
- Kouhei Tatumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magneto-optical recording medium, disk and method of manufacturing...
- Patent number 5,702,793
- Issue date Dec 30, 1997
- Nippon Steel Corporation
- Kenji Shimokawa
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Garnet polycrystalline film for magneto-optical recording medium
- Patent number 5,501,913
- Issue date Mar 26, 1996
- Nippon Steel Corporation
- Kenji Shimokawa
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Ball transferring method and apparatus
- Publication number 20080032495
- Publication date Feb 7, 2008
- Nippon Steel Materials Co., Ltd.
- Kenji Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ball transferring method and apparatus
- Publication number 20050176176
- Publication date Aug 11, 2005
- NIPPON STEEL CORPORATION
- Kenji Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SPHERICAL SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20040061224
- Publication date Apr 1, 2004
- NIPPON STEEL CORPORATION
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spherical semiconductor device and method for fabricating the same
- Publication number 20030020164
- Publication date Jan 30, 2003
- Nippon Steel Corporation
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball transferring method and apparatus
- Publication number 20020137324
- Publication date Sep 26, 2002
- Kenji Shimokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spherical semiconductor device and method for fabricating the same
- Publication number 20020132462
- Publication date Sep 19, 2002
- NIPPON STEEL CORPORATION
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PROVIDED WITH LOW MELTING POINT METAL BUMPS
- Publication number 20020036344
- Publication date Mar 28, 2002
- KOHEI TATSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPHERICAL SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20020011665
- Publication date Jan 31, 2002
- KOHEI TATSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PARTIALLY PLATING SUBSTRATE FOR ELECTRONIC DEVICES
- Publication number 20010012683
- Publication date Aug 9, 2001
- KOHEI TATSUMI
- H01 - BASIC ELECTRIC ELEMENTS

Kenji Shimokawa

Person

Patents Grantslast 30 patents

Ball transferring method and apparatus

Method for fabricating a semiconductor devices provided with low me...

Semiconductor device provided with low melting point metal bumps

Ball transferring method and apparatus

Spherical semiconductor device and method for fabricating the same

Method of partially plating substrate for electronic devices

Ball-arranging substrate for forming bump, ball-arranging head, bal...

Spherical semiconductor device and method for fabricating the same

Transfer of flux onto electrodes and production of bumps on electrodes

Production of small metal bumps

Magneto-optical recording medium, disk and method of manufacturing...

Garnet polycrystalline film for magneto-optical recording medium

Patents Applicationslast 30 patents

Ball transferring method and apparatus

Ball transferring method and apparatus

SPHERICAL SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Spherical semiconductor device and method for fabricating the same

Ball transferring method and apparatus

Spherical semiconductor device and method for fabricating the same

SEMICONDUCTOR DEVICE PROVIDED WITH LOW MELTING POINT METAL BUMPS

SPHERICAL SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

METHOD OF PARTIALLY PLATING SUBSTRATE FOR ELECTRONIC DEVICES