Kenji SUGAKAWA

Person

Koshi City, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bonding apparatus and bonding method
- Patent number 11,837,574
- Issue date Dec 5, 2023
- Tokyo Electron Limited
- Kenji Sugakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 11,735,465
- Issue date Aug 22, 2023
- Tokyo Electron Limited
- Kenji Sugakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method and recording medium
- Patent number 11,715,663
- Issue date Aug 1, 2023
- Tokyo Electron Limited
- Kenji Sugakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 11,482,431
- Issue date Oct 25, 2022
- Tokyo Electron Limited
- Kimio Motoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding system
- Patent number 11,164,842
- Issue date Nov 2, 2021
- Tokyo Electron Limited
- Yosuke Omori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,985,132
- Issue date Apr 20, 2021
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bonding system and bonding method
- Patent number 10,847,495
- Issue date Nov 24, 2020
- Tokyo Electron Limited
- Atsushi Nagata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,756,046
- Issue date Aug 25, 2020
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,438,920
- Issue date Oct 8, 2019
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bonding apparatus and bonding system
- Patent number 10,438,918
- Issue date Oct 8, 2019
- Tokyo Electron Limited
- Yosuke Omori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method, storage medium, bonding apparatus and bonding system
- Patent number 9,741,595
- Issue date Aug 22, 2017
- Tokyo Electron Limited
- Kenji Sugakawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD
- Publication number 20240304475
- Publication date Sep 12, 2024
- TOKYO ELECTRON LIMITED
- Kenji Sugakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PLACING METHOD
- Publication number 20240282617
- Publication date Aug 22, 2024
- TOKYO ELECTRON LIMITED
- Kimio Motoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PLACING METHOD
- Publication number 20240274462
- Publication date Aug 15, 2024
- TOKYO ELECTRON LIMITED
- Makoto Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20230014665
- Publication date Jan 19, 2023
- TOKYO ELECTRON LIMITED
- Kimio Motoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20210358879
- Publication date Nov 18, 2021
- TOKYO ELECTRON LIMITED
- Kenji Sugakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD AND RECORDING MEDIUM
- Publication number 20210272836
- Publication date Sep 2, 2021
- TOKYO ELECTRON LIMITED
- Kenji Sugakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20210035827
- Publication date Feb 4, 2021
- TOKYO ELECTRON LIMITED
- Kimio Motoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20200365442
- Publication date Nov 19, 2020
- TOKYO ELECTRON LIMITED
- Kenji Sugakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Apparatus, Bonding System, Bonding Method and Storage Medium
- Publication number 20200343216
- Publication date Oct 29, 2020
- TOKYO ELECTRON LIMITED
- Yoshitaka OTSUKA
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDING APPARATUS AND BONDING SYSTEM
- Publication number 20190385971
- Publication date Dec 19, 2019
- TOKYO ELECTRON LIMITED
- Yosuke Omori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Apparatus, Bonding System, Bonding Method and Storage Medium
- Publication number 20190385973
- Publication date Dec 19, 2019
- TOKYO ELECTRON LIMITED
- Yoshitaka OTSUKA
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDING SYSTEM AND BONDING METHOD
- Publication number 20190312007
- Publication date Oct 10, 2019
- TOKYO ELECTRON LIMITED
- Atsushi Nagata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD AND STORAGE MEDIUM
- Publication number 20180158796
- Publication date Jun 7, 2018
- TOKYO ELECTRON LIMITED
- Yoshitaka OTSUKA
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDING APPARATUS AND BONDING SYSTEM
- Publication number 20180047699
- Publication date Feb 15, 2018
- TOKYO ELECTRON LIMITED
- Yosuke Omori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Method, Storage Medium, Bonding Apparatus and Bonding System
- Publication number 20160155721
- Publication date Jun 2, 2016
- TOKYO ELECTRON LIMITED
- Kenji SUGAKAWA
- H01 - BASIC ELECTRIC ELEMENTS

Kenji SUGAKAWA

Person

Patents Grantslast 30 patents

Bonding apparatus and bonding method

Substrate processing apparatus and substrate processing method

Bonding apparatus, bonding system, bonding method and recording medium

Substrate processing apparatus and substrate processing method

Bonding apparatus and bonding system

Bonding apparatus, bonding system, bonding method and storage medium

Bonding system and bonding method

Bonding apparatus, bonding system, bonding method and storage medium

Bonding apparatus, bonding system, bonding method and storage medium

Bonding apparatus and bonding system

Bonding method, storage medium, bonding apparatus and bonding system

Patents Applicationslast 30 patents

BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PLACING METHOD

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PLACING METHOD

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

BONDING APPARATUS AND BONDING METHOD

BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD AND RECORDING MEDIUM

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Bonding Apparatus, Bonding System, Bonding Method and Storage Medium

BONDING APPARATUS AND BONDING SYSTEM

Bonding Apparatus, Bonding System, Bonding Method and Storage Medium

BONDING SYSTEM AND BONDING METHOD

BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD AND STORAGE MEDIUM

BONDING APPARATUS AND BONDING SYSTEM

Bonding Method, Storage Medium, Bonding Apparatus and Bonding System