Kenji SUZUKI

Person

Iwakurai-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayer wiring board for inspection of electronic components
- Patent number 10,690,716
- Issue date Jun 23, 2020
- NGK Spark Plug Co., Ltd.
- Junichirou Kanematsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for mounting light-emitting device
- Patent number 10,297,724
- Issue date May 21, 2019
- NGK Spark Plug Co., Ltd.
- Masahito Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for mounting light-emitting device
- Patent number 10,177,528
- Issue date Jan 8, 2019
- NGK Spark Plug Co., Ltd.
- Masahito Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing multilayer wiring board
- Patent number 9,179,553
- Issue date Nov 3, 2015
- NGK Spark Plug Co., Ltd.
- Kenji Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing wiring substrate having built-in component
- Patent number 9,167,702
- Issue date Oct 20, 2015
- NGK Spark Plug Co., Ltd.
- Kenji Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic substrate and method of manufacturing the same
- Patent number 9,107,334
- Issue date Aug 11, 2015
- NGK Spark Plug Co., Ltd.
- Kenji Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic substrate and method for manufacturing the same
- Patent number 9,049,786
- Issue date Jun 2, 2015
- NGK Spark Plug Co., Ltd.
- Toshihisa Nomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 8,933,342
- Issue date Jan 13, 2015
- NGK Spark Plug Co., Ltd.
- Kenji Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 8,674,236
- Issue date Mar 18, 2014
- NGK Spark Plug Co., Ltd.
- Kazunaga Higo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER WIRING BOARD FOR INSPECTION OF ELECTRONIC COMPONENTS
- Publication number 20190162778
- Publication date May 30, 2019
- NGK Spark Plug Co., Ltd.
- Junichirou KANEMATSU
- G01 - MEASURING TESTING
Information Patent Application
WIRING BOARD AND PLANAR TRANSFORMER
- Publication number 20190088408
- Publication date Mar 21, 2019
- NGK Spark Plug Co., Ltd.
- Masahito MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND PLANAR TRANSFORMER
- Publication number 20190090347
- Publication date Mar 21, 2019
- NGK Spark Plug Co., Ltd.
- Masahito MORITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND PLANAR TRANSFORMER
- Publication number 20190088409
- Publication date Mar 21, 2019
- NGK Spark Plug Co., Ltd.
- Masahito MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR MOUNTING LIGHT-EMITTING DEVICE
- Publication number 20190013641
- Publication date Jan 10, 2019
- NGK Spark Plug Co., Ltd.
- Masahito MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR MOUNTING LIGHT-EMITTING DEVICE
- Publication number 20190013442
- Publication date Jan 10, 2019
- NGK Spark Plug Co., Ltd.
- Masahito MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING WIRING SUBSTRATE HAVING BUILT-IN COMPONENT
- Publication number 20150181722
- Publication date Jun 25, 2015
- NGK Spark Plug Co., Ltd.
- Kenji SUZUKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20140293559
- Publication date Oct 2, 2014
- NGK SPARK PLUG CO., LTD.
- Kenji SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING WIRING SUBSTRATE
- Publication number 20130232784
- Publication date Sep 12, 2013
- NGK SPARK PLUG CO., LTD.
- Toshinori HIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING MULTILAYER WIRING BOARD
- Publication number 20130219712
- Publication date Aug 29, 2013
- NGK SPARK PLUG CO., LTD.
- Kenji SUZUKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130220691
- Publication date Aug 29, 2013
- NGK SPARK PLUG CO., LTD.
- Kenji SUZUKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130112461
- Publication date May 9, 2013
- NGK SPARK PLUG CO., LTD.
- Kenji SUZUKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130075141
- Publication date Mar 28, 2013
- NGK SPARK PLUG CO., LTD.
- Kenji SUZUKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING WIRING SUBSTRATE HAVING BUILT-IN COMPONENT
- Publication number 20130074332
- Publication date Mar 28, 2013
- NGK Spark Plug Co., Ltd.
- Kenji SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120247821
- Publication date Oct 4, 2012
- NGK SPARK PLUG CO., LTD.
- Toshihisa NOMURA
- G01 - MEASURING TESTING
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120205142
- Publication date Aug 16, 2012
- NGK SPARK PLUG CO., LTD.
- Kazunaga HIGO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Kenji SUZUKI

Person

Patents Grantslast 30 patents

Multilayer wiring board for inspection of electronic components

Package for mounting light-emitting device

Package for mounting light-emitting device

Method of manufacturing multilayer wiring board

Method of manufacturing wiring substrate having built-in component

Ceramic substrate and method of manufacturing the same

Ceramic substrate and method for manufacturing the same

Wiring substrate and method of manufacturing the same

Wiring substrate and method of manufacturing the same

Patents Applicationslast 30 patents

MULTILAYER WIRING BOARD FOR INSPECTION OF ELECTRONIC COMPONENTS

WIRING BOARD AND PLANAR TRANSFORMER

WIRING BOARD AND PLANAR TRANSFORMER

WIRING BOARD AND PLANAR TRANSFORMER

PACKAGE FOR MOUNTING LIGHT-EMITTING DEVICE

PACKAGE FOR MOUNTING LIGHT-EMITTING DEVICE

METHOD OF MANUFACTURING WIRING SUBSTRATE HAVING BUILT-IN COMPONENT

WIRING BOARD

METHOD OF MANUFACTURING WIRING SUBSTRATE

METHOD OF MANUFACTURING MULTILAYER WIRING BOARD

MULTILAYER WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING WIRING SUBSTRATE HAVING BUILT-IN COMPONENT

CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME