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Kenji Takano

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  • Kawasaki, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wiring board manufacturing method
    • Patent number 7,935,891
    • Issue date May 3, 2011
    • Fujitsu Limited
    • Takashi Shuto
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Process for producing circuit board
    • Patent number 7,441,330
    • Issue date Oct 28, 2008
    • Fujitsu Limited
    • Kenji Takano
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wiring board manufacturing method
    • Patent number 7,377,030
    • Issue date May 27, 2008
    • Fujitsu Limited
    • Takashi Shuto
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of manufacturing circuit board
    • Patent number 7,152,314
    • Issue date Dec 26, 2006
    • Fujitsu Limited
    • Takashi Shuto
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents