Kenji Terada

Person

Shiga-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-layer circuit using metal layers as a moisture diffusion barr...
- Patent number 10,687,420
- Issue date Jun 16, 2020
- International Business Machines Corporation
- Jean Audet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and probe card using the same
- Patent number 9,157,932
- Issue date Oct 13, 2015
- KYOCERA Circuit Solutions, Inc.
- Takayuki Taguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical module and optical wiring board
- Patent number 9,110,234
- Issue date Aug 18, 2015
- Kyocera Corporation
- Kenji Terada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and probe card using the same
- Patent number 8,836,361
- Issue date Sep 16, 2014
- KYOCERA SLC Technologies Corporation
- Takayuki Taguchi
- G01 - MEASURING TESTING
Information Patent Grant
Circuit board, mounting structure, and method for manufacturing cir...
- Patent number 8,284,557
- Issue date Oct 9, 2012
- Kyocera Corporation
- Yutaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board manufacturing method and printed circuit board
- Patent number 7,834,277
- Issue date Nov 16, 2010
- International Business Machines Corporation
- Kohichi Ohsumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of printed circuit board
- Patent number 7,726,016
- Issue date Jun 1, 2010
- International Business Machines Corporation
- Kohichi Ohsumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing process for organic chip carrier
- Patent number 5,784,781
- Issue date Jul 28, 1998
- International Business Machines Corporation
- Masaharu Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a liquid crystal display with a sealing member
- Patent number 5,276,541
- Issue date Jan 4, 1994
- International Business Machines Corporation
- Kenji Terada
- G02 - OPTICS
Information Patent Grant
Liquid crystal display device with an inlet sealant containing part...
- Patent number 5,105,290
- Issue date Apr 14, 1992
- International Business Machines Corporation
- Hitoshi Tomii
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL CIRCUIT BOARD AND METHOD FOR PRODUCING THE SAME
- Publication number 20160245997
- Publication date Aug 25, 2016
- KYOCERA Circuit Solutions, Inc.
- Kenji TERADA
- G02 - OPTICS
Information Patent Application
MULTI-LAYER CIRCUIT USING METAL LAYERS AS A MOISTURE DIFFUSION BARR...
- Publication number 20160211481
- Publication date Jul 21, 2016
- Kyocera Circuit Solutions Inc.
- Jean AUDET
- G01 - MEASURING TESTING
Information Patent Application
MULTI-LAYER CIRCUIT USING METAL LAYERS AS A MOISTURE DIFFUSION BARR...
- Publication number 20160211229
- Publication date Jul 21, 2016
- Kyocera Circuit Solutions Inc.
- Jean AUDET
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CIRCUIT USING METAL LAYERS AS A MOISTURE DIFFUSION BARR...
- Publication number 20160210398
- Publication date Jul 21, 2016
- Kyocera Circuit Solutions Inc.
- Jean AUDET
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
OPTICAL MODULE AND OPTICAL WIRING BOARD
- Publication number 20130272648
- Publication date Oct 17, 2013
- KYOCERA CORPORATION
- Kenji Terada
- G02 - OPTICS
Information Patent Application
WIRING BOARD AND PROBE CARD USING THE SAME
- Publication number 20130222003
- Publication date Aug 29, 2013
- KYOCERA SLC TECHNOLOGIES CORPORATION
- Takayuki TAGUCHI
- G01 - MEASURING TESTING
Information Patent Application
WIRING BOARD AND PROBE CARD USING THE SAME
- Publication number 20130169305
- Publication date Jul 4, 2013
- KYOCERA SLC TECHNOLOGIES CORPORATION
- Takayuki TAGUCHI
- G01 - MEASURING TESTING
Information Patent Application
Circuit Board, Mounting Structure, and Method for Manufacturing Cir...
- Publication number 20100254098
- Publication date Oct 7, 2010
- Kyocera Corporation
- Yutaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD MANUFACTURING METHOD AND PRINTED CIRCUIT BOARD
- Publication number 20080257597
- Publication date Oct 23, 2008
- International Business Machines Corporation
- Kohichi Ohsumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD MANUFACTURING METHOD AND PRINTED CIRCUIT BOARD
- Publication number 20040222015
- Publication date Nov 11, 2004
- INTERNATIONAL BUSINESS MACHINES CORPORATION
- Kohichi Ohsumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Kenji Terada

Person

Patents Grantslast 30 patents

Multi-layer circuit using metal layers as a moisture diffusion barr...

Wiring board and probe card using the same

Optical module and optical wiring board

Wiring board and probe card using the same

Circuit board, mounting structure, and method for manufacturing cir...

Printed circuit board manufacturing method and printed circuit board

Manufacturing method of printed circuit board

Manufacturing process for organic chip carrier

Method for forming a liquid crystal display with a sealing member

Liquid crystal display device with an inlet sealant containing part...

Patents Applicationslast 30 patents

OPTICAL CIRCUIT BOARD AND METHOD FOR PRODUCING THE SAME

MULTI-LAYER CIRCUIT USING METAL LAYERS AS A MOISTURE DIFFUSION BARR...

MULTI-LAYER CIRCUIT USING METAL LAYERS AS A MOISTURE DIFFUSION BARR...

MULTI-LAYER CIRCUIT USING METAL LAYERS AS A MOISTURE DIFFUSION BARR...

OPTICAL MODULE AND OPTICAL WIRING BOARD

WIRING BOARD AND PROBE CARD USING THE SAME

WIRING BOARD AND PROBE CARD USING THE SAME

Circuit Board, Mounting Structure, and Method for Manufacturing Cir...

PRINTED CIRCUIT BOARD MANUFACTURING METHOD AND PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD MANUFACTURING METHOD AND PRINTED CIRCUIT BOARD