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Kenji Tokunaga
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Hachioji, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor container opening/closing apparatus and semiconductor...
Patent number
7,314,345
Issue date
Jan 1, 2008
Renesas Technology Corp.
Yoshiaki Kobayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a semiconductor integrated circuit device w...
Patent number
7,048,493
Issue date
May 23, 2006
Hitachi Plant Engineering & Construction Co. LTD
Yoshiaki Kobayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
6,958,288
Issue date
Oct 25, 2005
Trecenti Technologies, Inc.
Kenji Tokunaga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of purging wafer receiving jig, wafer transfer device, and m...
Patent number
6,867,153
Issue date
Mar 15, 2005
Trecenti Technologies, Inc.
Kenji Tokunaga
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR CONTAINER OPENING/CLOSING APPARATUS AND SEMICONDUCTOR...
Publication number
20100086392
Publication date
Apr 8, 2010
Yoshiaki Kobayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CONTAINER OPENING/CLOSING APPARATUS AND SEMICONDUCTOR...
Publication number
20080107517
Publication date
May 8, 2008
Yoshiaki KOYAYASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor container opening/closing apparatus and semiconductor...
Publication number
20060182541
Publication date
Aug 17, 2006
Yoshiaki Kobayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of manufacturing a semiconductor integrated circuit device w...
Publication number
20050111937
Publication date
May 26, 2005
Yoshiaki Kobayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device and manufacturing method thereof
Publication number
20040238968
Publication date
Dec 2, 2004
TRECENTI TECHNOLOGIES, INC
Kenji Tokunaga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of purging wafer receiving jig, wafer transfer device, and m...
Publication number
20040152322
Publication date
Aug 5, 2004
Kenji Tokunaga
H01 - BASIC ELECTRIC ELEMENTS