Kenji Uhara

Person

Aich, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-layer polyimide films and flexible circuit substrates therefrom
- Patent number 7,452,610
- Issue date Nov 18, 2008
- Du Pont Toray Company Limited
- Kenji Uhara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically conductive polyimide compositions having a carbon nano...
- Patent number 7,273,661
- Issue date Sep 25, 2007
- DuPont Toray Co., Ltd.
- Hideki Moriyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Laminate type materials for flexible circuits or similar-type assem...
- Patent number 6,916,544
- Issue date Jul 12, 2005
- E. I. Du Pont de Nemours and Company
- Hideki Moriyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyimide film, method of manufacture, and metal interconnect board...
- Patent number 6,908,685
- Issue date Jun 21, 2005
- E. I. Du Pont de Nemours and Company
- Kenji Uhara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyimide film, method of manufacture, and metal interconnect board...
- Patent number 6,555,238
- Issue date Apr 29, 2003
- DuPont Toray Co. Ltd.
- Kenji Uhara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyimide film, method of manufacture, and metal interconnect board...
- Patent number 6,548,179
- Issue date Apr 15, 2003
- DuPont-Toray Co., Ltd.
- Kenji Uhara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Reflector substrate for illumination device and reflector for illum...
- Patent number 6,492,031
- Issue date Dec 10, 2002
- DuPont Toray Co. Ltd.
- Hideki Moriyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyimide film, a method for its manufacture and a polyimide film c...
- Patent number 6,277,495
- Issue date Aug 21, 2001
- E. I. Du Pont de Nemours and Company
- Koichi Sawasaki
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
Multi-layer polyimide films and flexible circuit substrates therefrom
- Publication number 20070003773
- Publication date Jan 4, 2007
- Kenji Uhara
- B32 - LAYERED PRODUCTS
Information Patent Application
Electrically conductive polyimide compositions having a carbon nano...
- Publication number 20040071990
- Publication date Apr 15, 2004
- Hideki Moriyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Polyimide film, method of manufacture, and metal interconnect board...
- Publication number 20040010113
- Publication date Jan 15, 2004
- Kenji Uhara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Laminate type materials for flexible circuits or similar-type assem...
- Publication number 20030215654
- Publication date Nov 20, 2003
- Hideki Moriyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Polyimide film, method of manufacture, and metal interconnect board...
- Publication number 20020045054
- Publication date Apr 18, 2002
- Kenji Uhara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Polyimide film, method of manufacture , and metal interconnect boar...
- Publication number 20020045033
- Publication date Apr 18, 2002
- Kenji Uhara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Kenji Uhara

Person

Patents Grantslast 30 patents

Multi-layer polyimide films and flexible circuit substrates therefrom

Electrically conductive polyimide compositions having a carbon nano...

Laminate type materials for flexible circuits or similar-type assem...

Polyimide film, method of manufacture, and metal interconnect board...

Polyimide film, method of manufacture, and metal interconnect board...

Polyimide film, method of manufacture, and metal interconnect board...

Reflector substrate for illumination device and reflector for illum...

Polyimide film, a method for its manufacture and a polyimide film c...

Patents Applicationslast 30 patents

Multi-layer polyimide films and flexible circuit substrates therefrom

Electrically conductive polyimide compositions having a carbon nano...

Polyimide film, method of manufacture, and metal interconnect board...

Laminate type materials for flexible circuits or similar-type assem...

Polyimide film, method of manufacture, and metal interconnect board...

Polyimide film, method of manufacture , and metal interconnect boar...