TREA

Kenjiro Enoki

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  • Nagano-shi, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Solder bump forming method
    • Patent number 7,807,560
    • Issue date Oct 5, 2010
    • Shinko Electric Industries Co., Ltd.
    • Kei Imafuji
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    SOLDER BUMP FORMING METHOD
    • Publication number 20090023281
    • Publication date Jan 22, 2009
    • Shinko Electric Industries Co., Ltd.
    • Kei Imafuji
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Pad structure of wiring board and wiring board
    • Publication number 20060209497
    • Publication date Sep 21, 2006
    • Kazuhiko Ooi
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...