Kenneth A. Bird

Person

New Platz, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electromigration-resistant lead-free solder interconnect structures
- Patent number 9,379,007
- Issue date Jun 28, 2016
- Globalfoundries Inc.
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and arrangements to assess thermal performance
- Patent number 7,734,444
- Issue date Jun 8, 2010
- International Business Machines Corporation
- Ronald Xavier Arroyo
- G01 - MEASURING TESTING
Information Patent Grant
Systems and arrangements to assess thermal performance
- Patent number 7,338,818
- Issue date Mar 4, 2008
- International Business Machines Corporation
- Ronald Xavier Arroyo
- G01 - MEASURING TESTING
Information Patent Grant
Planar metallized substrate with embedded camber control material a...
- Patent number 6,285,080
- Issue date Sep 4, 2001
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal cost reduced substrate structure method and apparatus
- Patent number 5,946,552
- Issue date Aug 31, 1999
- International Business Machines Corporation
- Kenneth Alfred Bird
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package with decoupling capacitors completely...
- Patent number 5,831,810
- Issue date Nov 3, 1998
- International Business Machines Corporation
- Kenneth A. Bird
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for object inspection
- Patent number 5,220,617
- Issue date Jun 15, 1993
- International Business Machines Corporation
- Kenneth A. Bird
- G01 - MEASURING TESTING
Information Patent Grant
Advanced via inspection tool (AVIT)
- Patent number 5,216,485
- Issue date Jun 1, 1993
- International Business Machines Corporation
- Kenneth A. Bird
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES
- Publication number 20130249066
- Publication date Sep 26, 2013
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES
- Publication number 20130252418
- Publication date Sep 26, 2013
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Arrangements to Assess Thermal Performance
- Publication number 20080112456
- Publication date May 15, 2008
- Ronald Xavier Arroyo
- G01 - MEASURING TESTING
Information Patent Application
Systems and arrangements to assess thermal performance
- Publication number 20060263912
- Publication date Nov 23, 2006
- Ronald Xavier Arroyo
- G01 - MEASURING TESTING

Kenneth A. Bird

Person

Patents Grantslast 30 patents

Electromigration-resistant lead-free solder interconnect structures

Systems and arrangements to assess thermal performance

Systems and arrangements to assess thermal performance

Planar metallized substrate with embedded camber control material a...

Universal cost reduced substrate structure method and apparatus

Electronic component package with decoupling capacitors completely...

Method and apparatus for object inspection

Advanced via inspection tool (AVIT)

Patents Applicationslast 30 patents

ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES

ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES

Systems and Arrangements to Assess Thermal Performance

Systems and arrangements to assess thermal performance