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Kenneth B. Gilleo
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West Kingston, RI, US
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Patents Grants
last 30 patents
Information
Patent Grant
Flip chip with integrated flux and underfill
Patent number
6,265,776
Issue date
Jul 24, 2001
Fry's Metals, Inc.
Ken Gilleo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Compliant semiconductor chip assemblies and methods of making same
Patent number
6,252,301
Issue date
Jun 26, 2001
Tessera, Inc.
Kenneth B. Gilleo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic component mounting with deformable shell terminals
Patent number
6,204,455
Issue date
Mar 20, 2001
Tessera, Inc.
Kenneth B. Gilleo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Snap cure adhesive based on anhydride/epoxy resins
Patent number
6,096,808
Issue date
Aug 1, 2000
Alpha Metals, Inc.
Ken Gilleo
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Compliant semiconductor chip assemblies and methods of making same
Patent number
6,020,220
Issue date
Feb 1, 2000
Tessera, Inc.
Kenneth B. Gilleo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Color indicator for completion of polymerization for thermosets
Patent number
6,017,983
Issue date
Jan 25, 2000
Alpha Metals, Inc.
Ken Gilleo
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Microelectronic component mounting with deformable shell terminals
Patent number
5,971,253
Issue date
Oct 26, 1999
Tessera, Inc.
Kenneth B. Gilleo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for producing ordered Z-axis adhesive materials, materials...
Patent number
5,637,176
Issue date
Jun 10, 1997
Fry's Metals, Inc.
Kenneth B. Gilleo
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Method of making electroconductive adhesive particles for Z-axis ap...
Patent number
5,531,942
Issue date
Jul 2, 1996
Fry's Metals, Inc.
Kenneth B. Gilleo
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Method of forming interface between die and chip carrier
Patent number
5,477,611
Issue date
Dec 26, 1995
Tessera, Inc.
Jason Sweis
G06 - COMPUTING CALCULATING COUNTING
Patents Applications
last 30 patents
Information
Patent Application
Electronic package with insert conductor array
Publication number
20050046016
Publication date
Mar 3, 2005
Ken Gilleo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Flip chip with integrated flux and underfill
Publication number
20010000929
Publication date
May 10, 2001
Ken Gilleo
H01 - BASIC ELECTRIC ELEMENTS