Kenneth C. K. Cheng

Person

Albany, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Removal of barrier and liner layers from a bottom of a via
- Patent number 11,735,475
- Issue date Aug 22, 2023
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractive back-end-of-line vias
- Patent number 11,410,879
- Issue date Aug 9, 2022
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully aligned interconnects with selective area deposition
- Patent number 11,289,375
- Issue date Mar 29, 2022
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully-aligned top-via structures with top-via trim
- Patent number 11,282,768
- Issue date Mar 22, 2022
- International Business Machines Corporation
- Kenneth C. K. Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BEOL metallization formation
- Patent number 11,270,913
- Issue date Mar 8, 2022
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back end of line metallization
- Patent number 11,244,897
- Issue date Feb 8, 2022
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully aligned via interconnects with partially removed etch stop layer
- Patent number 11,244,853
- Issue date Feb 8, 2022
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual damascene fully aligned via in interconnects
- Patent number 11,244,854
- Issue date Feb 8, 2022
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via interconnect with self-aligned barrier layer
- Patent number 11,205,591
- Issue date Dec 21, 2021
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully-aligned skip-vias
- Patent number 11,201,112
- Issue date Dec 14, 2021
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pitch multiplication with high pattern fidelity
- Patent number 11,201,056
- Issue date Dec 14, 2021
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects with enlarged contact area
- Patent number 11,183,455
- Issue date Nov 23, 2021
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated top via interconnects
- Patent number 11,177,171
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects with gouged vias
- Patent number 11,177,169
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removal of barrier and liner layers from a bottom of a via
- Patent number 11,177,170
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via structure with enlarged contact area with upper metallizati...
- Patent number 11,177,163
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects with hybrid metal conductors
- Patent number 11,177,214
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects with spacer structure for forming air-gaps
- Patent number 11,164,774
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom barrier free interconnects without voids
- Patent number 11,164,815
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully aligned top vias with replacement metal lines
- Patent number 11,139,202
- Issue date Oct 5, 2021
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removal or reduction of chamfer for fully-aligned via
- Patent number 11,127,676
- Issue date Sep 21, 2021
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method to fabricate fully aligned via with reduced co...
- Patent number 11,094,580
- Issue date Aug 17, 2021
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded anti-fuses for small scale applications
- Patent number 11,024,577
- Issue date Jun 1, 2021
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects having air gap spacers
- Patent number 10,950,493
- Issue date Mar 16, 2021
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air-gap containing metal interconnects
- Patent number 10,748,812
- Issue date Aug 18, 2020
- International Business Machines Corporation
- Kenneth C. K. Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DOUBLE PATTERNING WITH SELECTIVELY DEPOSITED SPACER
- Publication number 20230197511
- Publication date Jun 22, 2023
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVAL OF BARRIER AND LINER LAYERS FROM A BOTTOM OF A VIA
- Publication number 20220028738
- Publication date Jan 27, 2022
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY ALIGNED VIA INTERCONNECTS WITH PARTIALLY REMOVED ETCH STOP LAYER
- Publication number 20210335659
- Publication date Oct 28, 2021
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEOL METALLIZATION FORMATION
- Publication number 20210335666
- Publication date Oct 28, 2021
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS WITH ENLARGED CONTACT AREA
- Publication number 20210327803
- Publication date Oct 21, 2021
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK END OF LINE METALLIZATION
- Publication number 20210313264
- Publication date Oct 7, 2021
- International Business Machines Corporation
- CHANRO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE BACK-END-OF-LINE VIAS
- Publication number 20210313226
- Publication date Oct 7, 2021
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL DAMASCENE FULLY ALIGNED VIA INTERCONNECTS
- Publication number 20210305090
- Publication date Sep 30, 2021
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY ALIGNED INTERCONNECTS WITH SELECTIVE AREA DEPOSITION
- Publication number 20210296172
- Publication date Sep 23, 2021
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH MULTIPLICATION WITH HIGH PATTERN FIDELITY
- Publication number 20210296127
- Publication date Sep 23, 2021
- International Business Machines Corporation
- CHANRO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP VIA STRUCTURE WITH ENLARGED CONTACT AREA WITH UPPER METALLIZATI...
- Publication number 20210296164
- Publication date Sep 23, 2021
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVAL OR REDUCTION OF CHAMFER FOR FULLY-ALIGNED VIA
- Publication number 20210225759
- Publication date Jul 22, 2021
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS WITH SPACER STRUCTURE FOR FORMING AIR-GAPS
- Publication number 20210225691
- Publication date Jul 22, 2021
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY-ALIGNED SKIP-VIAS
- Publication number 20210225760
- Publication date Jul 22, 2021
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVAL OF BARRIER AND LINER LAYERS FROM A BOTTOM OF A VIA
- Publication number 20210225702
- Publication date Jul 22, 2021
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP VIA INTERCONNECT WITH SELF-ALIGNED BARRIER LAYER
- Publication number 20210217662
- Publication date Jul 15, 2021
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS WITH HYBRID METAL CONDUCTORS
- Publication number 20210217698
- Publication date Jul 15, 2021
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY-ALIGNED TOP-VIA STRUCTURES WITH TOP-VIA TRIM
- Publication number 20210143085
- Publication date May 13, 2021
- International Business Machines Corporation
- Kenneth C. K. Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bottom Barrier Free Interconnects Without Voids
- Publication number 20210098388
- Publication date Apr 1, 2021
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED TOP VIA INTERCONNECTS
- Publication number 20210098293
- Publication date Apr 1, 2021
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY ALIGNED TOP VIAS WITH REPLACEMENT METAL LINES
- Publication number 20210098284
- Publication date Apr 1, 2021
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD TO FABRICATE FULLY ALIGNED VIA WITH REDUCED CO...
- Publication number 20210098287
- Publication date Apr 1, 2021
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS HAVING AIR GAP SPACERS
- Publication number 20210090938
- Publication date Mar 25, 2021
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS WITH GOUGED VIAS
- Publication number 20200402844
- Publication date Dec 24, 2020
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Air-Gap Containing Metal Interconnects
- Publication number 20200273743
- Publication date Aug 27, 2020
- International Business Machines Corporation
- Kenneth C. K. Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Kenneth C. K. Cheng

Person

Patents Grantslast 30 patents

Removal of barrier and liner layers from a bottom of a via

Subtractive back-end-of-line vias

Fully aligned interconnects with selective area deposition

Fully-aligned top-via structures with top-via trim

BEOL metallization formation

Back end of line metallization

Fully aligned via interconnects with partially removed etch stop layer

Dual damascene fully aligned via in interconnects

Top via interconnect with self-aligned barrier layer

Fully-aligned skip-vias

Pitch multiplication with high pattern fidelity

Interconnects with enlarged contact area

Encapsulated top via interconnects

Interconnects with gouged vias

Removal of barrier and liner layers from a bottom of a via

Top via structure with enlarged contact area with upper metallizati...

Interconnects with hybrid metal conductors

Interconnects with spacer structure for forming air-gaps

Bottom barrier free interconnects without voids

Fully aligned top vias with replacement metal lines

Removal or reduction of chamfer for fully-aligned via

Structure and method to fabricate fully aligned via with reduced co...

Embedded anti-fuses for small scale applications

Interconnects having air gap spacers

Air-gap containing metal interconnects

Patents Applicationslast 30 patents

DOUBLE PATTERNING WITH SELECTIVELY DEPOSITED SPACER

REMOVAL OF BARRIER AND LINER LAYERS FROM A BOTTOM OF A VIA

FULLY ALIGNED VIA INTERCONNECTS WITH PARTIALLY REMOVED ETCH STOP LAYER

BEOL METALLIZATION FORMATION

INTERCONNECTS WITH ENLARGED CONTACT AREA

BACK END OF LINE METALLIZATION

SUBTRACTIVE BACK-END-OF-LINE VIAS

DUAL DAMASCENE FULLY ALIGNED VIA INTERCONNECTS

FULLY ALIGNED INTERCONNECTS WITH SELECTIVE AREA DEPOSITION

PITCH MULTIPLICATION WITH HIGH PATTERN FIDELITY

TOP VIA STRUCTURE WITH ENLARGED CONTACT AREA WITH UPPER METALLIZATI...

REMOVAL OR REDUCTION OF CHAMFER FOR FULLY-ALIGNED VIA

INTERCONNECTS WITH SPACER STRUCTURE FOR FORMING AIR-GAPS

FULLY-ALIGNED SKIP-VIAS

REMOVAL OF BARRIER AND LINER LAYERS FROM A BOTTOM OF A VIA

TOP VIA INTERCONNECT WITH SELF-ALIGNED BARRIER LAYER

INTERCONNECTS WITH HYBRID METAL CONDUCTORS

FULLY-ALIGNED TOP-VIA STRUCTURES WITH TOP-VIA TRIM

Bottom Barrier Free Interconnects Without Voids

ENCAPSULATED TOP VIA INTERCONNECTS

FULLY ALIGNED TOP VIAS WITH REPLACEMENT METAL LINES

STRUCTURE AND METHOD TO FABRICATE FULLY ALIGNED VIA WITH REDUCED CO...

INTERCONNECTS HAVING AIR GAP SPACERS

INTERCONNECTS WITH GOUGED VIAS

Air-Gap Containing Metal Interconnects