Kenneth Cholewczynski

Follow

Person

Streamwood, IL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Low temperature method for forming solder bump interconnections to...
- Patent number 5,269,453
- Issue date Dec 14, 1993
- Motorola, Inc.
- Cynthia M. Melton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder plate reflow method for forming solder-bumped terminals
- Patent number 5,194,137
- Issue date Mar 16, 1993
- Motorola Inc.
- Kevin D. Moore
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming solder bump interconnections to a solder-plated...
- Patent number 5,186,383
- Issue date Feb 16, 1993
- Motorola, Inc.
- Cynthia Melton
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder plate reflow method for forming a solder bump on a circuit t...
- Patent number 5,160,409
- Issue date Nov 3, 1992
- Motorola, Inc.
- Kevin D. Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical component package comprising polymer-reinforced solder b...
- Patent number 5,120,678
- Issue date Jun 9, 1992
- Motorola Inc.
- Kevin D. Moore
- H01 - BASIC ELECTRIC ELEMENTS