Kenneth M. Kramer

Person

Corvallis, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Fluid ejector structure
- Patent number 8,651,630
- Issue date Feb 18, 2014
- Hewlett-Packard Development Company, L.P.
- Adel Jilani
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Semiconductor package with getter formed over an irregular structure
- Patent number 7,732,902
- Issue date Jun 8, 2010
- Hewlett-Packard Development Company, L.P.
- James C. McKinnell
- G01 - MEASURING TESTING
Information Patent Grant
Methods for controlling feature dimensions in crystalline substrates
- Patent number 7,473,649
- Issue date Jan 6, 2009
- Steven D Leith
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Semiconductor package with getter formed over an irregular structure
- Patent number 7,147,908
- Issue date Dec 12, 2006
- Hewlett-Packard Development Company, L.P.
- James C. McKinnell
- G01 - MEASURING TESTING
Information Patent Grant
Methods for controlling feature dimensions in crystalline substrates
- Patent number 7,105,456
- Issue date Sep 12, 2006
- Hewlett-Packard Development Company, L.P.
- Steven D. Leith
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method of forming substrate for fluid ejection device
- Patent number 6,893,577
- Issue date May 17, 2005
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Tunnel-junction structures and methods
- Patent number 6,821,848
- Issue date Nov 23, 2004
- Hewlett-Packard Development Company, L.P.
- Dennis Lazaroff
- G11 - INFORMATION STORAGE
Information Patent Grant
Slotted substrate and slotting process
- Patent number 6,818,138
- Issue date Nov 16, 2004
- Hewlett-Packard Development Company, L.P.
- Jeffrey Scott Obert
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Phase change material electronic memory structure and method for fo...
- Patent number 6,605,821
- Issue date Aug 12, 2003
- Hewlett-Packard Development Company, L.P.
- Heon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for fluid ejection device
- Patent number 6,554,403
- Issue date Apr 29, 2003
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Particle tolerant ink-feed channel structure for fully integrated i...
- Patent number 6,364,466
- Issue date Apr 2, 2002
- Hewlett-Packard Company
- Chien-Hua Chen
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Patents Applicationslast 30 patents

Information Patent Application
FLUID EJECTOR STRUCTURE
- Publication number 20110285794
- Publication date Nov 24, 2011
- Adel Jilani
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Semiconductor package with getter formed over an irregular structure
- Publication number 20070052108
- Publication date Mar 8, 2007
- James C. McKinnell
- G01 - MEASURING TESTING
Information Patent Application
Methods for controlling feature dimensions in crystalline substrates
- Publication number 20060264055
- Publication date Nov 23, 2006
- Steven D. Leith
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Methods for controlling feature dimensions in crystalline substrates
- Publication number 20060094200
- Publication date May 4, 2006
- Steven D. Leith
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Semiconductor package with getter formed over an irregular structure
- Publication number 20060083896
- Publication date Apr 20, 2006
- James C. McKinnell
- G01 - MEASURING TESTING
Information Patent Application
Mold release layer
- Publication number 20050272599
- Publication date Dec 8, 2005
- Kenneth Kramer
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of forming substrate for fluid ejection device
- Publication number 20030202049
- Publication date Oct 30, 2003
- Chien-Hua Chen
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Tunnel-junction structures and methods
- Publication number 20030186468
- Publication date Oct 2, 2003
- Dennis Lazaroff
- G11 - INFORMATION STORAGE
Information Patent Application
Slotted substrate and slotting process
- Publication number 20020195420
- Publication date Dec 26, 2002
- Jeffrey Scott Obert
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Kenneth M. Kramer

Person

Patents Grantslast 30 patents

Fluid ejector structure

Semiconductor package with getter formed over an irregular structure

Methods for controlling feature dimensions in crystalline substrates

Semiconductor package with getter formed over an irregular structure

Methods for controlling feature dimensions in crystalline substrates

Method of forming substrate for fluid ejection device

Tunnel-junction structures and methods

Slotted substrate and slotting process

Phase change material electronic memory structure and method for fo...

Substrate for fluid ejection device

Particle tolerant ink-feed channel structure for fully integrated i...

Patents Applicationslast 30 patents

FLUID EJECTOR STRUCTURE

Semiconductor package with getter formed over an irregular structure

Methods for controlling feature dimensions in crystalline substrates

Methods for controlling feature dimensions in crystalline substrates

Semiconductor package with getter formed over an irregular structure

Mold release layer

Method of forming substrate for fluid ejection device

Tunnel-junction structures and methods

Slotted substrate and slotting process