KENNETH R. RHYNER

Person

Rockwall, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Millimeter wave integrated circuit with ball grid array package inc...
- Patent number 10,262,957
- Issue date Apr 16, 2019
- Texas Instruments Incorporated
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter wave integrated circuit with ball grid array package inc...
- Patent number 9,941,228
- Issue date Apr 10, 2018
- Texas Instruments Incorporated
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter wave integrated circuit with ball grid array package inc...
- Patent number 9,666,553
- Issue date May 30, 2017
- Texas Instruments Incorporated
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an integrated circuit package including a direct...
- Patent number 8,828,799
- Issue date Sep 9, 2014
- Texas Instruments Incorporated
- Kenneth Robert Rhyner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging with ball grid array having differenti...
- Patent number 8,674,505
- Issue date Mar 18, 2014
- Texas Instruments Incorporated
- Kenneth R. Rhyner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package including a direct connect pad, a blind...
- Patent number 8,598,048
- Issue date Dec 3, 2013
- Texas Instruments Incorporated
- Kenneth Robert Rhyner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BGA package with traces for plating pads under the chip
- Patent number 8,053,349
- Issue date Nov 8, 2011
- Texas Instruments Incorporated
- Kenneth R. Rhyner
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INC...
- Publication number 20180301428
- Publication date Oct 18, 2018
- Rajen Manicon Murugan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INC...
- Publication number 20170229408
- Publication date Aug 10, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Rajen Manicon MURUGAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INC...
- Publication number 20150364816
- Publication date Dec 17, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Rajen Manicon MURUGAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming an Integrated Circuit Package Including a Direct...
- Publication number 20130295722
- Publication date Nov 7, 2013
- Kenneth Robert Rhyner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packaging With Ball Grid Array Having Differenti...
- Publication number 20130175684
- Publication date Jul 11, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Kenneth R. Rhyner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE INCLUDING A DIRECT CONNECT PAD, A BLIND...
- Publication number 20130026642
- Publication date Jan 31, 2013
- Kenneth Robert Rhyner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BGA PACKAGE WITH TRACES FOR PLATING PADS UNDER THE CHIP
- Publication number 20120013003
- Publication date Jan 19, 2012
- TEXAS INSTRUMENTS INCORPORATED
- KENNETH R. RHYNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH EMI SHIELD
- Publication number 20100006987
- Publication date Jan 14, 2010
- Rajen Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Inductance Ball Grid Array Device Having Chip Bumps on Substrat...
- Publication number 20090289362
- Publication date Nov 26, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Kenneth R. Rhyner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTENDED PLATING TRACE IN FLIP CHIP SOLDER MASK WINDOW
- Publication number 20090140419
- Publication date Jun 4, 2009
- Kenneth Rhyner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BGA Package with Traces for Plating Pads Under the Chip
- Publication number 20090115072
- Publication date May 7, 2009
- TEXAS INSTRUMENTS INCORPORATED
- KENNETH R. RHYNER
- H01 - BASIC ELECTRIC ELEMENTS

KENNETH R. RHYNER

Person

Patents Grantslast 30 patents

Millimeter wave integrated circuit with ball grid array package inc...

Millimeter wave integrated circuit with ball grid array package inc...

Millimeter wave integrated circuit with ball grid array package inc...

Method of forming an integrated circuit package including a direct...

Integrated circuit packaging with ball grid array having differenti...

Integrated circuit package including a direct connect pad, a blind...

BGA package with traces for plating pads under the chip

Patents Applicationslast 30 patents

MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INC...

MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INC...

MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INC...

Method of Forming an Integrated Circuit Package Including a Direct...

Integrated Circuit Packaging With Ball Grid Array Having Differenti...

INTEGRATED CIRCUIT PACKAGE INCLUDING A DIRECT CONNECT PAD, A BLIND...

BGA PACKAGE WITH TRACES FOR PLATING PADS UNDER THE CHIP

INTEGRATED CIRCUIT PACKAGE WITH EMI SHIELD

Low Inductance Ball Grid Array Device Having Chip Bumps on Substrat...

EXTENDED PLATING TRACE IN FLIP CHIP SOLDER MASK WINDOW

BGA Package with Traces for Plating Pads Under the Chip