Kenneth Teik Kheong Low

Follow

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing an electronic device package
- Patent number 6,588,098
- Issue date Jul 8, 2003
- Semiconductor Components Industries LLC
- Boon Huat Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for forming same
- Patent number 6,376,266
- Issue date Apr 23, 2002
- Semiconductor Components Industries LLC
- James Price Letterman
- H01 - BASIC ELECTRIC ELEMENTS