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Kenneth Wong
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Chandler, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Deep via seed repair using electroless plating chemistry
Patent number
7,479,687
Issue date
Jan 20, 2009
Intel Corporation
Thomas S. Dory
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing an interconnected circuit board assembly
Patent number
7,191,515
Issue date
Mar 20, 2007
Intel Corporation
Robert C. Sundahl
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Interconnected circuit board assembly and system
Patent number
6,621,168
Issue date
Sep 16, 2003
Intel Corporation
Robert C. Sundahl
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Deep via seed repair using electroless plating chemistry
Publication number
20060068181
Publication date
Mar 30, 2006
Thomas S. Dory
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Deep via seed repair using electroless plating chemistry
Publication number
20050067295
Publication date
Mar 31, 2005
Thomas S. Dory
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for manufacturing an interconnected circuit board assembly a...
Publication number
20040070082
Publication date
Apr 15, 2004
Intel Corporation
Robert C. Sundahl
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Interconnected circuit board assembly and method of manufacture the...
Publication number
20020084536
Publication date
Jul 4, 2002
Robert C. Sundahl
H01 - BASIC ELECTRIC ELEMENTS