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Kenny Chang

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  • Hsin-Tien City, TW
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Circuit carrier and package structure thereof
    • Publication number 20050167815
    • Publication date Aug 4, 2005
    • Kenny Chang
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Chip package structure
    • Publication number 20050035448
    • Publication date Feb 17, 2005
    • Chi-Hsing Hsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Package substrate and process thereof
    • Publication number 20050035181
    • Publication date Feb 17, 2005
    • Kenny Chang
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Chip package structure
    • Publication number 20050012226
    • Publication date Jan 20, 2005
    • Kenny Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Hybrid integrated circuit package substrate
    • Publication number 20040251559
    • Publication date Dec 16, 2004
    • Shelton Lu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Chip package structure
    • Publication number 20040046255
    • Publication date Mar 11, 2004
    • Chi-Hsing Hsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Flip-chip bump arrangement for decreasing impedance
    • Publication number 20020190390
    • Publication date Dec 19, 2002
    • Via Technologies, Inc.
    • Hsueh-Chung Shelton Lu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Conductive wiring layer structure
    • Publication number 20020170742
    • Publication date Nov 21, 2002
    • Yuangtsang Liaw
    • H01 - BASIC ELECTRIC ELEMENTS