Kenny King-Tai Ngan

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for processing substrates in a system having h...
- Patent number 6,672,864
- Issue date Jan 6, 2004
- Applied Materials, Inc.
- Hougong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for balancing an electrostatic force produced...
- Patent number 6,625,003
- Issue date Sep 23, 2003
- Applied Materials, Inc.
- David Loo
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Precleaning process for metal plug that minimizes damage to low-&#x...
- Patent number 6,589,890
- Issue date Jul 8, 2003
- Applied Materials, Inc.
- Barney M. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for improving sidewall coverage during sputter...
- Patent number 6,475,356
- Issue date Nov 5, 2002
- Applied Materials, Inc.
- Ken Ngan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming solder bumps on a semiconductor wafer
- Patent number 6,426,282
- Issue date Jul 30, 2002
- Applied Materials, Inc.
- Dinesh Saigal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ti/Tinx underlayer which enables a highly <111> ori...
- Patent number 6,420,260
- Issue date Jul 16, 2002
- Applied Materials, Inc.
- Kenny King-tai Ngan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of improving adhesion of diffusion layers on fluorinated sil...
- Patent number 6,372,301
- Issue date Apr 16, 2002
- Applied Materials, Inc.
- Murali Narasimhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Precleaning process for metal plug that minimizes damage to low-&#x...
- Patent number 6,346,489
- Issue date Feb 12, 2002
- Applied Materials, Inc.
- Barney M. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning contact with successive fluorine and hydrogen plasmas
- Patent number 6,313,042
- Issue date Nov 6, 2001
- Applied Materials, Inc.
- Barney M. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
End effector for semiconductor wafer transfer device and method of...
- Patent number 6,267,423
- Issue date Jul 31, 2001
- Applied Materials, Inc.
- Dan A. Marohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated PVD system for aluminum hole filling using ionized metal...
- Patent number 6,238,533
- Issue date May 29, 2001
- Applied Materials, Inc.
- Peter Satitpunwaycha
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method to reduce overhead time in an ion metal plasma process
- Patent number 6,207,027
- Issue date Mar 27, 2001
- Applied Materials, Inc.
- Kenny King-Tai Ngan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Pasting layer formation method for high density plasma deposition c...
- Patent number 6,176,978
- Issue date Jan 23, 2001
- Applied Materials, Inc.
- Kenny King-Tai Ngan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputtering chamber shield promoting reliable plasma ignition
- Patent number 6,149,784
- Issue date Nov 21, 2000
- Applied Materials, Inc.
- Jingang Su
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of producing smooth titanium nitride films having low resist...
- Patent number 6,149,777
- Issue date Nov 21, 2000
- Applied Materials, Inc.
- Kenny King-tai Ngan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Reactive plasma etch cleaning of high aspect ratio openings
- Patent number 6,110,836
- Issue date Aug 29, 2000
- Applied Materials, Inc.
- Barney M. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pedestal insulator for a pre-clean chamber
- Patent number 6,077,353
- Issue date Jun 20, 2000
- Applied Materials, Inc.
- Mohamed A. Al-Sharif
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of titanium nitride films having improved uniformity
- Patent number 6,071,811
- Issue date Jun 6, 2000
- Applied Materials, Inc.
- Kenny King-Tai Ngan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Smooth titanium nitride films having low resistivity
- Patent number 6,059,872
- Issue date May 9, 2000
- Applied Materials, Inc.
- Kenny King-tai Ngan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Use of pulsed-DC wafer bias for filling vias/trenches with metal in...
- Patent number 6,051,114
- Issue date Apr 18, 2000
- Applied Materials, Inc.
- Tse-Yong Yao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Aluminum hole filling method using ionized metal adhesion layer
- Patent number 6,045,666
- Issue date Apr 4, 2000
- Applied Materials, Inc.
- Peter Satitpunwaycha
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Continuous process for forming improved titanium nitride barrier la...
- Patent number 5,972,178
- Issue date Oct 26, 1999
- Applied Materials, Inc.
- Murali K. Narasimhan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of reducing generation of particulate matter in a sputtering...
- Patent number 5,961,793
- Issue date Oct 5, 1999
- Applied Materials, Inc.
- Kenny K. Ngan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Treatment of a titanium nitride layer to improve resistance to elev...
- Patent number 5,943,600
- Issue date Aug 24, 1999
- Applied Materials, Inc.
- Kenny King-Tai Ngan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing smooth titanium nitride films having low resist...
- Patent number 5,925,225
- Issue date Jul 20, 1999
- Applied Materials, Inc.
- Kenny King-tai Ngan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for depositing golden titanium nitride
- Patent number 5,919,342
- Issue date Jul 6, 1999
- Applied Materials, Inc.
- Kenny King-Tai Ngan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming a barrier layer which enables a consistently high...
- Patent number 5,882,399
- Issue date Mar 16, 1999
- Applied Materials, Inc.
- Kenny King-tai Ngan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer clean sputtering process
- Patent number 5,759,360
- Issue date Jun 2, 1998
- Applied Materials, Inc.
- Kenny King-Tai Ngan
- B08 - CLEANING
Information Patent Grant
End effector for semiconductor wafer transfer device and method of...
- Patent number 5,746,460
- Issue date May 5, 1998
- Applied Materials, Inc.
- Dan A. Marohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Avoiding contamination from induction coil in ionized sputtering
- Patent number 5,707,498
- Issue date Jan 13, 1998
- Applied Materials, Inc.
- Kenny King-Tai Ngan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
In-situ monitoring of target erosion
- Publication number 20060081459
- Publication date Apr 20, 2006
- APPLIED MATERIALS, INC.
- Kenneth Chien-Quen Tsai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
POLISHING PAD CONDITIONER WITH SHAPED ABRASIVE PATTERNS AND CHANNELS
- Publication number 20060079160
- Publication date Apr 13, 2006
- APPLIED MATERIALS, INC.
- Venkata R. Balagani
- B24 - GRINDING POLISHING
Information Patent Application
Reduced oxygen arc spray
- Publication number 20060024440
- Publication date Feb 2, 2006
- APPLIED MATERIALS, INC.
- Kenneth Tsai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Coating for aluminum component
- Publication number 20060024517
- Publication date Feb 2, 2006
- APPLIED MATERIALS, INC.
- Trung T. Doan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus for improving sidewall coverage during sputter...
- Publication number 20050205414
- Publication date Sep 22, 2005
- APPLIED MATERIALS, INC.
- Kenny King-tai Ngan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Refurbishment of sputtering targets
- Publication number 20050199486
- Publication date Sep 15, 2005
- APPLIED MATERIALS, INC.
- Trung T. Doan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for processing substrates in a system having h...
- Publication number 20040166697
- Publication date Aug 26, 2004
- Hougong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for modulating stress in films deposited using a physical va...
- Publication number 20040060812
- Publication date Apr 1, 2004
- APPLIED MATERIALS, INC.
- Jr-Jyan Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Reducing particle generation during sputter deposition
- Publication number 20030196890
- Publication date Oct 23, 2003
- APPLIED MATERIALS, INC.
- Hien-Minh Huu Le
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor wafer preheating
- Publication number 20030133773
- Publication date Jul 17, 2003
- APPLIED MATERIALS, INC.
- Hougong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for balancing an electrostatic force produced...
- Publication number 20030053283
- Publication date Mar 20, 2003
- APPLIED MATERIALS, INC.
- David Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for processing substrates in a system having h...
- Publication number 20030044742
- Publication date Mar 6, 2003
- APPLIED MATERIALS, INC.
- Hougong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for improving sidewall coverage during sputter...
- Publication number 20030038025
- Publication date Feb 27, 2003
- APPLIED MATERIALS, INC.
- Ken Ngan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of producing smooth titanium nitride films having low resist...
- Publication number 20020125123
- Publication date Sep 12, 2002
- Kenny King-tai Ngan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Precleaning process for metal plug that minimizes damage to low-kap...
- Publication number 20020106908
- Publication date Aug 8, 2002
- APPLIED MATERIALS, INC.
- Barney M. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesion of diffusion barrier and fluorinated silicon dioxide using...
- Publication number 20020102365
- Publication date Aug 1, 2002
- APPLIED MATERIALS, INC.
- Murali Narasimhan
- H01 - BASIC ELECTRIC ELEMENTS

Kenny King-Tai Ngan

Person

Patents Grantslast 30 patents

Method and apparatus for processing substrates in a system having h...

Method and apparatus for balancing an electrostatic force produced...

Precleaning process for metal plug that minimizes damage to low-&#x...

Method and apparatus for improving sidewall coverage during sputter...

Method of forming solder bumps on a semiconductor wafer

Ti/Tinx underlayer which enables a highly &#x0003C;111&#x0003E; ori...

Method of improving adhesion of diffusion layers on fluorinated sil...

Precleaning process for metal plug that minimizes damage to low-&#x...

Cleaning contact with successive fluorine and hydrogen plasmas

End effector for semiconductor wafer transfer device and method of...

Integrated PVD system for aluminum hole filling using ionized metal...

Method to reduce overhead time in an ion metal plasma process

Pasting layer formation method for high density plasma deposition c...

Sputtering chamber shield promoting reliable plasma ignition

Method of producing smooth titanium nitride films having low resist...

Reactive plasma etch cleaning of high aspect ratio openings

Pedestal insulator for a pre-clean chamber

Deposition of titanium nitride films having improved uniformity

Smooth titanium nitride films having low resistivity

Use of pulsed-DC wafer bias for filling vias/trenches with metal in...

Aluminum hole filling method using ionized metal adhesion layer

Continuous process for forming improved titanium nitride barrier la...

Method of reducing generation of particulate matter in a sputtering...

Treatment of a titanium nitride layer to improve resistance to elev...

Method of producing smooth titanium nitride films having low resist...

Method for depositing golden titanium nitride

Method of forming a barrier layer which enables a consistently high...

Wafer clean sputtering process

End effector for semiconductor wafer transfer device and method of...

Avoiding contamination from induction coil in ionized sputtering

Patents Applicationslast 30 patents

In-situ monitoring of target erosion

POLISHING PAD CONDITIONER WITH SHAPED ABRASIVE PATTERNS AND CHANNELS

Reduced oxygen arc spray

Coating for aluminum component

Method and apparatus for improving sidewall coverage during sputter...

Refurbishment of sputtering targets

Method and apparatus for processing substrates in a system having h...

Method for modulating stress in films deposited using a physical va...

Reducing particle generation during sputter deposition

Semiconductor wafer preheating

Method and apparatus for balancing an electrostatic force produced...

Method and apparatus for processing substrates in a system having h...

Method and apparatus for improving sidewall coverage during sputter...

Method of producing smooth titanium nitride films having low resist...

Precleaning process for metal plug that minimizes damage to low-kap...

Adhesion of diffusion barrier and fluorinated silicon dioxide using...

Ti/Tinx underlayer which enables a highly <111> ori...