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Kenny Lee
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Seoul, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device and method of calibrating warpage testing syst...
Patent number
9,279,673
Issue date
Mar 8, 2016
STATS ChipPAC, Ltd.
WonJun Ko
G01 - MEASURING TESTING
Information
Patent Grant
Integrated circuit packaging system with interposer interconnection...
Patent number
8,558,366
Issue date
Oct 15, 2013
Stats Chippac Ltd.
A Leam Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with interposer interconnection...
Patent number
8,080,446
Issue date
Dec 20, 2011
Stats Chippac Ltd.
A Leam Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire bond capillary tip
Patent number
7,407,080
Issue date
Aug 5, 2008
ChipPAC, Inc.
Kenny Lee
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor Device and Method of Calibrating Warpage Testing Syst...
Publication number
20140269810
Publication date
Sep 18, 2014
STATS ChipPAC, Ltd.
WonJun Ko
G01 - MEASURING TESTING
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER INTERCONNECTION...
Publication number
20120086115
Publication date
Apr 12, 2012
A Leam Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER INTERCONNECTION...
Publication number
20100301469
Publication date
Dec 2, 2010
A Leam Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wire bond capillary Tip
Publication number
20050218188
Publication date
Oct 6, 2005
ChipPAC, Inc.
Kenny Lee
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR