Kenro Nakamura

Person

Kamakura-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,673,147
- Issue date Jun 6, 2017
- Kabushiki Kaisha Toshiba
- Kenro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,287,225
- Issue date Mar 15, 2016
- Kabushiki Kaisha Toshiba
- Kenro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and manufacturing apparatus
- Patent number 9,123,717
- Issue date Sep 1, 2015
- Kabushiki Kaisha Toshiba
- Kenro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus
- Patent number 7,367,873
- Issue date May 6, 2008
- Ebara Corporation
- You Ishii
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing method and polishing liquid
- Patent number 7,354,861
- Issue date Apr 8, 2008
- Kabushiki Kaisha Toshiba
- Kenro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and polishing apparatus
- Patent number 7,351,131
- Issue date Apr 1, 2008
- Kabushiki Kaisha Toshiba
- Kenro Nakamura
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus
- Patent number 7,066,787
- Issue date Jun 27, 2006
- Ebara Corporation
- Masayuki Nakanishi
- B24 - GRINDING POLISHING
Information Patent Grant
Method for manufacturing semiconductor device and polishing apparatus
- Patent number 6,933,234
- Issue date Aug 23, 2005
- Kabushiki Kaisha Toshiba
- Kenro Nakamura
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad, polishing apparatus and polishing method
- Patent number 6,620,336
- Issue date Sep 16, 2003
- Kabushiki Kaisha Toshiba
- Kenro Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 6,429,134
- Issue date Aug 6, 2002
- Kabushiki Kaisha Toshiba
- Takeo Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing method
- Patent number 6,239,032
- Issue date May 29, 2001
- Kabushiki Kaisha Toshiba
- Kenro Nakamura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 6,096,631
- Issue date Aug 1, 2000
- Kabushiki Kaisha Toshiba
- Kenro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME SEMICONDU...
- Publication number 20160268163
- Publication date Sep 15, 2016
- Kabushiki Kaisha Toshiba
- Kenro NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20160141247
- Publication date May 19, 2016
- Kabushiki Kaisha Toshiba
- Kenro NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARILY BONDING SUPPORT SUBSTRATE AND SEMICONDUCTOR DEVICE MANU...
- Publication number 20160064265
- Publication date Mar 3, 2016
- Kabushiki Kaisha Toshiba
- Kenro NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20150028493
- Publication date Jan 29, 2015
- Kabushiki Kaisha Toshiba
- Kenro NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS
- Publication number 20140242779
- Publication date Aug 28, 2014
- Kabushiki Kaisha Toshiba
- Kenro NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING DEVICE AND POLISHING METHOD
- Publication number 20110081832
- Publication date Apr 7, 2011
- Kenro Nakamura
- B24 - GRINDING POLISHING
Information Patent Application
Substrate processing apparatus
- Publication number 20080188167
- Publication date Aug 7, 2008
- You Ishii
- B24 - GRINDING POLISHING
Information Patent Application
Reactive detection chip and spotter suitable for manufacturing the...
- Publication number 20050254998
- Publication date Nov 17, 2005
- EBARA CORPORATION
- Kenro Nakamura
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Method for manufacturing semiconductor device and polishing apparatus
- Publication number 20050250423
- Publication date Nov 10, 2005
- Kabushiki Kaisha Toshiba
- Kenro Nakamura
- B24 - GRINDING POLISHING
Information Patent Application
Substrate processing apparatus
- Publication number 20040185751
- Publication date Sep 23, 2004
- Masayuki Nakanishi
- B24 - GRINDING POLISHING
Information Patent Application
Substrate processing apparatus
- Publication number 20040106363
- Publication date Jun 3, 2004
- You Ishii
- B24 - GRINDING POLISHING
Information Patent Application
Method for manufacturing semiconductor device and polishing apparatus
- Publication number 20030139049
- Publication date Jul 24, 2003
- Kenro Nakamura
- B24 - GRINDING POLISHING
Information Patent Application
Polishing pad, polishing apparatus and polishing method
- Publication number 20010024878
- Publication date Sep 27, 2001
- Kabushiki Kaisha Toshiba
- Kenro Nakamura
- B24 - GRINDING POLISHING

Kenro Nakamura

Person

Patents Grantslast 30 patents

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device manufacturing method and manufacturing apparatus

Substrate processing apparatus

Polishing method and polishing liquid

Method for manufacturing semiconductor device and polishing apparatus

Substrate processing apparatus

Method for manufacturing semiconductor device and polishing apparatus

Polishing pad, polishing apparatus and polishing method

Method of manufacturing semiconductor device

Polishing method

Method of manufacturing semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME SEMICONDU...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

TEMPORARILY BONDING SUPPORT SUBSTRATE AND SEMICONDUCTOR DEVICE MANU...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS

POLISHING DEVICE AND POLISHING METHOD

Substrate processing apparatus

Reactive detection chip and spotter suitable for manufacturing the...

Method for manufacturing semiconductor device and polishing apparatus

Substrate processing apparatus

Substrate processing apparatus

Method for manufacturing semiconductor device and polishing apparatus

Polishing pad, polishing apparatus and polishing method