Kenrou Jitumori

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Kyoto, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device, semiconductor packaging method, assembly and...
- Patent number 6,853,077
- Issue date Feb 8, 2005
- Matsushita Electric Industrial Co., Ltd.
- Seishi Oida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device, semiconductor packaging method, assembly and...
- Publication number 20030089923
- Publication date May 15, 2003
- Matsushita Electric Industrial Co., Ltd.
- Seishi Oida
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...