Kensaku Maeda

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Imaging device
- Patent number 12,189,085
- Issue date Jan 7, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Atsushi Yamamoto
- G02 - OPTICS
Information Patent Grant
Imaging device
- Patent number 12,170,853
- Issue date Dec 17, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Atsushi Yamamoto
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image pickup element, image pickup device, manufacturing device and...
- Patent number 11,961,861
- Issue date Apr 16, 2024
- Sony Group Corporation
- Yoichi Ootsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image pickup element, image pickup device, manufacturing device and...
- Patent number 11,646,339
- Issue date May 9, 2023
- Sony Group Corporation
- Yoichi Ootsuka
- G02 - OPTICS
Information Patent Grant
Imaging device
- Patent number 11,606,519
- Issue date Mar 14, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Atsushi Yamamoto
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Apparatuses and packages including a semiconductor substrate with a...
- Patent number 11,600,648
- Issue date Mar 7, 2023
- Sony Group Corporation
- Takaaki Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having improved dicing properties
- Patent number 11,594,563
- Issue date Feb 28, 2023
- Sony Corporation
- Atsushi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting module, display device, and methods for manufacturin...
- Patent number 11,437,603
- Issue date Sep 6, 2022
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kensaku Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image pickup element, image pickup device, manufacturing device and...
- Patent number 11,411,031
- Issue date Aug 9, 2022
- Sony Group Corporation
- Yoichi Ootsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and packages including a semiconductor substrate with a...
- Patent number 11,037,975
- Issue date Jun 15, 2021
- Sony Corporation
- Takaaki Hirano
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor including grooves
- Patent number 11,024,658
- Issue date Jun 1, 2021
- Sony Corporation
- Atsushi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated lens structure, camera module, and method for manufacturi...
- Patent number 10,866,345
- Issue date Dec 15, 2020
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Atsushi Yamamoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Hard tip band-saw blade
- Patent number 10,821,531
- Issue date Nov 3, 2020
- AMADA HOLDINGS CO., LTD.
- Yoshihiro Yamashita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Image sensor having improved dicing properties
- Patent number 10,608,028
- Issue date Mar 31, 2020
- Sony Corporation
- Atsushi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device, manufacturing method for display device, and electr...
- Patent number 10,566,403
- Issue date Feb 18, 2020
- Sony Corporation
- Takashi Sakairi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Color change member, light emitting device, display device and elec...
- Patent number 10,539,849
- Issue date Jan 21, 2020
- Joled Inc
- Yusuke Moriya
- G02 - OPTICS
Information Patent Grant
Image pickup element, image pickup device, manufacturing device and...
- Patent number 10,461,107
- Issue date Oct 29, 2019
- Sony Corporation
- Yoichi Ootsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and electronic apparatus including a package having a micro...
- Patent number 10,332,924
- Issue date Jun 25, 2019
- Sony Corporation
- Takaaki Hirano
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Solid-state image pickup element, image pickup apparatus, electroni...
- Patent number 10,236,315
- Issue date Mar 19, 2019
- Sony Corporation
- Yutaka Ooka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged image sensor having improved dicing properties
- Patent number 10,038,021
- Issue date Jul 31, 2018
- Sony Corporation
- Atsushi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having improved dicing properties, manufacturing appar...
- Patent number 9,991,301
- Issue date Jun 5, 2018
- Sony Corporation
- Atsushi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical sensor, chemical sensor module, chemical substance detecti...
- Patent number 9,958,386
- Issue date May 1, 2018
- Sony Corporation
- Yusuke Moriya
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and electronic apparatus including an organic...
- Patent number 9,941,318
- Issue date Apr 10, 2018
- Sony Corporation
- Takaaki Hirano
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Solid-state imaging apparatus with on-chip lens and micro-lens
- Patent number 9,813,679
- Issue date Nov 7, 2017
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kensaku Maeda
- G02 - OPTICS
Information Patent Grant
Semiconductor device and electronic apparatus
- Patent number 9,728,568
- Issue date Aug 8, 2017
- Sony Corporation
- Takaaki Hirano
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Chemical sensor, chemical sensor module, biomolecule detection appa...
- Patent number 9,670,532
- Issue date Jun 6, 2017
- Sony Corporation
- Nobuyuki Matsuzawa
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Chemical sensor, chemical sensor module, chemical detection apparat...
- Patent number 9,618,457
- Issue date Apr 11, 2017
- Sony Corporation
- Masanori Iwasaki
- G02 - OPTICS
Information Patent Grant
Solid-state imaging apparatus having a micro-lens arranged in corre...
- Patent number 9,110,210
- Issue date Aug 18, 2015
- Sony Corporation
- Kensaku Maeda
- G02 - OPTICS
Information Patent Grant
Solid-state imaging device, method for manufacturing solid-state im...
- Patent number 9,111,828
- Issue date Aug 18, 2015
- Sony Corporation
- Kensaku Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device, method for manufacturing solid-state im...
- Patent number 8,710,608
- Issue date Apr 29, 2014
- Sony Corporation
- Kensaku Maeda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Imaging Device
- Publication number 20250071437
- Publication date Feb 27, 2025
- Sony Semiconductor Solutions Corporation
- Atsushi YAMAMOTO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFAC...
- Publication number 20240355849
- Publication date Oct 24, 2024
- Sony Semiconductor Solutions Corporation
- TAICHI NATORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE PICKUP ELEMENT, IMAGE PICKUP DEVICE, MANUFACTURING DEVICE AND...
- Publication number 20230238415
- Publication date Jul 27, 2023
- SONY GROUP CORPORATION
- Yoichi Ootsuka
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20230178575
- Publication date Jun 8, 2023
- SONY GROUP CORPORATION
- Takaaki HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20230039889
- Publication date Feb 9, 2023
- Sony Semiconductor Solutions Corporation
- KENSAKU MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT SOURCE DEVICE, METHOD FOR MANUFACTURING LIGHT SOURCE DEVICE,...
- Publication number 20230030731
- Publication date Feb 2, 2023
- Sony Semiconductor Solutions Corporation
- KENSAKU MAEDA
- G01 - MEASURING TESTING
Information Patent Application
IMAGE PICKUP ELEMENT, IMAGE PICKUP DEVICE, MANUFACTURING DEVICE AND...
- Publication number 20220278156
- Publication date Sep 1, 2022
- SONY GROUP CORPORATION
- Yoichi Ootsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE
- Publication number 20220236454
- Publication date Jul 28, 2022
- Sony Semiconductor Solutions Corporation
- ATSUSHI YAMAMOTO
- G02 - OPTICS
Information Patent Application
IMAGING DEVICE
- Publication number 20220217290
- Publication date Jul 7, 2022
- Sony Semiconductor Solutions Corporation
- Atsushi YAMAMOTO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...
- Publication number 20210305300
- Publication date Sep 30, 2021
- SONY CORPORATION
- Atsushi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20210265407
- Publication date Aug 26, 2021
- SONY GROUP CORPORATION
- Takaaki HIRANO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGING DEVICE
- Publication number 20210211595
- Publication date Jul 8, 2021
- Sony Semiconductor Solutions Corporation
- Atsushi YAMAMOTO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210005688
- Publication date Jan 7, 2021
- Sony Semiconductor Solutions Corporation
- Kimihiro Shinya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING MODULE, DISPLAY DEVICE, AND METHODS FOR MANUFACTURIN...
- Publication number 20200395575
- Publication date Dec 17, 2020
- Sony Semiconductor Solutions Corporation
- Kensaku Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...
- Publication number 20200273897
- Publication date Aug 27, 2020
- SONY CORPORATION
- Atsushi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE PICKUP ELEMENT, IMAGE PICKUP DEVICE, MANUFACTURING DEVICE AND...
- Publication number 20200066776
- Publication date Feb 27, 2020
- SONY CORPORATION
- Yoichi OOTSUKA
- G02 - OPTICS
Information Patent Application
HARD TIP BAND-SAW BLADE
- Publication number 20200009669
- Publication date Jan 9, 2020
- AMADA HOLDINGS CO., LTD.
- Yoshihiro YAMASHITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20190244996
- Publication date Aug 8, 2019
- SONY CORPORATION
- Takaaki HIRANO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
LAMINATED LENS STRUCTURE, CAMERA MODULE, AND METHOD FOR MANUFACTURI...
- Publication number 20190162880
- Publication date May 30, 2019
- Sony Semiconductor Solutions Corporation
- Atsushi YAMAMOTO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...
- Publication number 20180331142
- Publication date Nov 15, 2018
- SONY CORPORATION
- Atsushi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20180190700
- Publication date Jul 5, 2018
- SONY CORPORATION
- Takaaki HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE, MANUFACTURING METHOD FOR DISPLAY DEVICE, AND ELECTR...
- Publication number 20180040681
- Publication date Feb 8, 2018
- SONY CORPORATION
- Takashi Sakairi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20170287964
- Publication date Oct 5, 2017
- SONY CORPORATION
- Takaaki HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...
- Publication number 20170271389
- Publication date Sep 21, 2017
- SONY CORPORATION
- Atsushi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL SENSOR, METHOD OF PRODUCING CHEMICAL SENSOR, AND CHEMICAL...
- Publication number 20170241997
- Publication date Aug 24, 2017
- SONY CORPORATION
- Hideaki Mogi
- G01 - MEASURING TESTING
Information Patent Application
IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...
- Publication number 20170236860
- Publication date Aug 17, 2017
- SONY CORPORATION
- Atsushi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE PICKUP ELEMENT, IMAGE PICKUP APPARATUS, ELECTRONI...
- Publication number 20160027822
- Publication date Jan 28, 2016
- SONY CORPORATION
- Yutaka OOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20160027830
- Publication date Jan 28, 2016
- SONY CORPORATION
- Takaaki HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING APPARATUS, METHOD OF MANUFACTURING SOLID-STATE...
- Publication number 20150334358
- Publication date Nov 19, 2015
- SONY CORPORATION
- Kensaku Maeda
- G02 - OPTICS
Information Patent Application
COLOR CHANGE MEMBER, LIGHT EMITTING DEVICE, DISPLAY DEVICE AND ELEC...
- Publication number 20150276175
- Publication date Oct 1, 2015
- SONY CORPORATION
- Yusuke Moriya
- G02 - OPTICS

Kensaku Maeda

Person

Patents Grantslast 30 patents

Imaging device

Imaging device

Image pickup element, image pickup device, manufacturing device and...

Image pickup element, image pickup device, manufacturing device and...

Imaging device

Apparatuses and packages including a semiconductor substrate with a...

Image sensor having improved dicing properties

Light-emitting module, display device, and methods for manufacturin...

Image pickup element, image pickup device, manufacturing device and...

Apparatuses and packages including a semiconductor substrate with a...

Image sensor including grooves

Laminated lens structure, camera module, and method for manufacturi...

Hard tip band-saw blade

Image sensor having improved dicing properties

Display device, manufacturing method for display device, and electr...

Color change member, light emitting device, display device and elec...

Image pickup element, image pickup device, manufacturing device and...

Package and electronic apparatus including a package having a micro...

Solid-state image pickup element, image pickup apparatus, electroni...

Packaged image sensor having improved dicing properties

Image sensor having improved dicing properties, manufacturing appar...

Chemical sensor, chemical sensor module, chemical substance detecti...

Semiconductor device and electronic apparatus including an organic...

Solid-state imaging apparatus with on-chip lens and micro-lens

Semiconductor device and electronic apparatus

Chemical sensor, chemical sensor module, biomolecule detection appa...

Chemical sensor, chemical sensor module, chemical detection apparat...

Solid-state imaging apparatus having a micro-lens arranged in corre...

Solid-state imaging device, method for manufacturing solid-state im...

Solid-state imaging device, method for manufacturing solid-state im...

Patents Applicationslast 30 patents

Imaging Device

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFAC...

IMAGE PICKUP ELEMENT, IMAGE PICKUP DEVICE, MANUFACTURING DEVICE AND...

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

LIGHT-EMITTING APPARATUS AND MANUFACTURING METHOD THEREOF

LIGHT SOURCE DEVICE, METHOD FOR MANUFACTURING LIGHT SOURCE DEVICE,...

IMAGE PICKUP ELEMENT, IMAGE PICKUP DEVICE, MANUFACTURING DEVICE AND...

IMAGING DEVICE

IMAGING DEVICE

IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

IMAGING DEVICE

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

LIGHT-EMITTING MODULE, DISPLAY DEVICE, AND METHODS FOR MANUFACTURIN...

IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...

IMAGE PICKUP ELEMENT, IMAGE PICKUP DEVICE, MANUFACTURING DEVICE AND...

HARD TIP BAND-SAW BLADE

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

LAMINATED LENS STRUCTURE, CAMERA MODULE, AND METHOD FOR MANUFACTURI...

IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

DISPLAY DEVICE, MANUFACTURING METHOD FOR DISPLAY DEVICE, AND ELECTR...

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...

CHEMICAL SENSOR, METHOD OF PRODUCING CHEMICAL SENSOR, AND CHEMICAL...

IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPAR...

SOLID-STATE IMAGE PICKUP ELEMENT, IMAGE PICKUP APPARATUS, ELECTRONI...

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

SOLID-STATE IMAGING APPARATUS, METHOD OF MANUFACTURING SOLID-STATE...

COLOR CHANGE MEMBER, LIGHT EMITTING DEVICE, DISPLAY DEVICE AND ELEC...