Kenshu Oyama

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Kakogawa-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Solder deposition method and solder bump forming method
- Patent number 7,452,797
- Issue date Nov 18, 2008
- Harima Chemicals, Inc.
- Youichi Kukimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Solder deposition method and solder bump forming method
- Publication number 20040209451
- Publication date Oct 21, 2004
- HARIMA CHEMICALS, INC.
- Youichi Kukimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR