Kensuke IDE

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Room-temperature-bonded semiconductor device and manufacturing meth...
- Patent number 10,486,263
- Issue date Nov 26, 2019
- MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
- Jun Utsumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device manufactured by room-temperature bonding, device manufacturi...
- Patent number 10,112,376
- Issue date Oct 30, 2018
- MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL, CO., LTD.
- Jun Utsumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Room temperature bonding apparatus and room temperature bonding method
- Patent number 9,580,306
- Issue date Feb 28, 2017
- MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
- Masato Kinouchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Room-temperature bonding apparatus
- Patent number 9,443,711
- Issue date Sep 13, 2016
- Mitsubishi Heavy Industries Machine Tool Co., Ltd.
- Masato Kinouchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding device and wafer bonding method
- Patent number 9,130,000
- Issue date Sep 8, 2015
- Mitsubishi Heavy Industries
- Takeshi Tsuno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding unit control unit and multi-layer bonding method
- Patent number 9,064,910
- Issue date Jun 23, 2015
- Mitsubishi Heavy Industries, Ltd.
- Masato Kinouchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding unit control unit and multi-layer bonding method
- Patent number 9,023,170
- Issue date May 5, 2015
- Mitsubishi Heavy Industries, Ltd.
- Masato Kinouchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Room temperature bonding apparatus
- Patent number 9,005,390
- Issue date Apr 14, 2015
- Mitsubishi Heavy Industries, Ltd.
- Takeshi Tsuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Room temperature bonding machine and room temperature bonding method
- Patent number 8,985,175
- Issue date Mar 24, 2015
- Mitsubishi Heavy Industries, Ltd.
- Masato Kinouchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufcaturing method for room-temperature substrate bonding
- Patent number 8,936,998
- Issue date Jan 20, 2015
- Mitsubishi Heavy Industries, Ltd.
- Jun Utsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Room temperature bonding apparatus
- Patent number 8,906,175
- Issue date Dec 9, 2014
- Mitsubishi Heavy Industries, Ltd.
- Masato Kinouchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Room temperature bonding apparatus
- Patent number 8,857,487
- Issue date Oct 14, 2014
- Mitsubishi Heavy Industries, Ltd.
- Takeshi Tsuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Room-temperature bonding method and room-temperature bonding appara...
- Patent number 8,608,048
- Issue date Dec 17, 2013
- Mitsubishi Heavy Industries, Ltd.
- Takayuki Goto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Room temperature bonding using sputtering
- Patent number 8,602,289
- Issue date Dec 10, 2013
- Mitsubishi Heavy Industries, Ltd.
- Takayuki Goto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Machine tool
- Patent number 6,698,982
- Issue date Mar 2, 2004
- Mitsubishi Heavy Industries, Ltd.
- Akira Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE JOINING METHOD
- Publication number 20190172813
- Publication date Jun 6, 2019
- MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
- Jun UTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20170355040
- Publication date Dec 14, 2017
- MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
- Jun UTSUMI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ROOM-TEMPERATURE BONDING APPARATUS
- Publication number 20170162428
- Publication date Jun 8, 2017
- MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
- Masato KINOUCHI
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE MANUFACTURED BY ROOM-TEMPERATURE BONDING, DEVICE MANUFACTURI...
- Publication number 20160250838
- Publication date Sep 1, 2016
- MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
- Jun UTSUMI
- B32 - LAYERED PRODUCTS
Information Patent Application
ROOM-TEMPERATURE BONDED DEVICE, WAFER HAVING ROOM-TEMPERATURE BONDE...
- Publication number 20150294900
- Publication date Oct 15, 2015
- Mitsubishi Heavy Industries, Ltd.
- Takayuki Goto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ROOM TEMPERATURE BONDING APPARATUS AND ROOM TEMPERATURE BONDING METHOD
- Publication number 20150251904
- Publication date Sep 10, 2015
- Mitsubishi Heavy Industries, Ltd.
- Masato Kinouchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ROOM-TEMPERATURE BONDING APPARATUS AND ROOM-TEMPERATURE BONDING METHOD
- Publication number 20150249026
- Publication date Sep 3, 2015
- Mitsubishi Heavy Industries, Ltd.
- Takeshi Tsuno
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ROOM-TEMPERATURE BONDING APPARATUS
- Publication number 20140224405
- Publication date Aug 14, 2014
- Mitsubishi Heavy Industries, Ltd.
- Masato Kinouchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND DEVICE MANUFACTURE METHOD
- Publication number 20130213561
- Publication date Aug 22, 2013
- Jun UTSUMI
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
ROOM TEMPERATURE BONDING APPARATUS AND ROOM TEMPERATURE BONDING METHOD
- Publication number 20130112334
- Publication date May 9, 2013
- Mitsubishi Heavy Industries, Ltd.
- Takeshi Tsuno
- B32 - LAYERED PRODUCTS
Information Patent Application
Room Temperature Bonding Apparatus
- Publication number 20120285624
- Publication date Nov 15, 2012
- Takeshi Tsuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDING APPARATUS, AND BONDING SYSTEM
- Publication number 20120247645
- Publication date Oct 4, 2012
- MITSUBISHI HEAVY INDUSTIRIES, LTD.
- Keiichiro Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING UNIT CONTROL UNIT AND MULTI-LAYER BONDING METHOD
- Publication number 20120031557
- Publication date Feb 9, 2012
- Mitsubishi Heavy Industries, Ltd.,
- Masato Kinouchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ROOM TEMPERATURE BONDING APPARATUS
- Publication number 20110277904
- Publication date Nov 17, 2011
- Mitsubishi Heavy Industries, Ltd.
- Masato Kinouchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROOM-TEMPERATURE BONDING METHOD AND ROOM-TEMPERATURE BONDING APPARATUS
- Publication number 20110214816
- Publication date Sep 8, 2011
- Takayuki Goto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER BONDING DEVICE AND WAFER BONDING METHOD
- Publication number 20110207291
- Publication date Aug 25, 2011
- Mitsubishi Heavy Industries, Ltd.,
- Takeshi Tsuno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROOM TEMPERATURE BONDING MACHINE AND ROOM TEMPERATURE BONDING METHOD
- Publication number 20110083801
- Publication date Apr 14, 2011
- Mitsubishi Heavy Industries, Ltd.
- Masato Kinouchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROOM TEMPERATURE BONDING APPARATUS
- Publication number 20110011536
- Publication date Jan 20, 2011
- Takeshi Tsuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND DEVICE MANUFACTURE METHOD
- Publication number 20100276723
- Publication date Nov 4, 2010
- MITSUBUISHI HEAVY INDUSTRIES, LTD.
- Jun Utsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE MANUFACTURED BY ROOM-TEMPERATURE BONDING, DEVICE MANUFACTURI...
- Publication number 20100092786
- Publication date Apr 15, 2010
- Mitsubishi Heavy Industries, Ltd.
- Jun Utsumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROOM-TEMPERATURE BONDING METHOD AND ROOM-TEMPERATURE BONDING APPARATUS
- Publication number 20100000663
- Publication date Jan 7, 2010
- Takayuki Goto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Machine tool
- Publication number 20030091405
- Publication date May 15, 2003
- Akira Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Kensuke IDE

Person

Patents Grantslast 30 patents

Room-temperature-bonded semiconductor device and manufacturing meth...

Device manufactured by room-temperature bonding, device manufacturi...

Room temperature bonding apparatus and room temperature bonding method

Room-temperature bonding apparatus

Wafer bonding device and wafer bonding method

Bonding unit control unit and multi-layer bonding method

Bonding unit control unit and multi-layer bonding method

Room temperature bonding apparatus

Room temperature bonding machine and room temperature bonding method

Manufcaturing method for room-temperature substrate bonding

Room temperature bonding apparatus

Room temperature bonding apparatus

Room-temperature bonding method and room-temperature bonding appara...

Room temperature bonding using sputtering

Machine tool

Patents Applicationslast 30 patents

SUBSTRATE JOINING METHOD

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

ROOM-TEMPERATURE BONDING APPARATUS

DEVICE MANUFACTURED BY ROOM-TEMPERATURE BONDING, DEVICE MANUFACTURI...

ROOM-TEMPERATURE BONDED DEVICE, WAFER HAVING ROOM-TEMPERATURE BONDE...

ROOM TEMPERATURE BONDING APPARATUS AND ROOM TEMPERATURE BONDING METHOD

ROOM-TEMPERATURE BONDING APPARATUS AND ROOM-TEMPERATURE BONDING METHOD

ROOM-TEMPERATURE BONDING APPARATUS

DEVICE AND DEVICE MANUFACTURE METHOD

ROOM TEMPERATURE BONDING APPARATUS AND ROOM TEMPERATURE BONDING METHOD

Room Temperature Bonding Apparatus

BONDING METHOD, BONDING APPARATUS, AND BONDING SYSTEM

BONDING UNIT CONTROL UNIT AND MULTI-LAYER BONDING METHOD

ROOM TEMPERATURE BONDING APPARATUS

ROOM-TEMPERATURE BONDING METHOD AND ROOM-TEMPERATURE BONDING APPARATUS

WAFER BONDING DEVICE AND WAFER BONDING METHOD

ROOM TEMPERATURE BONDING MACHINE AND ROOM TEMPERATURE BONDING METHOD

ROOM TEMPERATURE BONDING APPARATUS

DEVICE AND DEVICE MANUFACTURE METHOD

DEVICE MANUFACTURED BY ROOM-TEMPERATURE BONDING, DEVICE MANUFACTURI...

ROOM-TEMPERATURE BONDING METHOD AND ROOM-TEMPERATURE BONDING APPARATUS

Machine tool